The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Sep. 11, 2012
Timothy H. Daubenspeck, Colchester, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
Christopher D. Muzzy, Burlington, VT (US);
Wolfgang Sauter, Richmond, VT (US);
Timothy D. Sullivan, Underhill, VT (US);
Timothy H. Daubenspeck, Colchester, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
Christopher D. Muzzy, Burlington, VT (US);
Wolfgang Sauter, Richmond, VT (US);
Timothy D. Sullivan, Underhill, VT (US);
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Abstract
Various embodiments include methods of forming interconnect structures, and the structures formed by such methods. In one embodiment, a method can include: providing a precursor interconnect structure having: a photosensitive polyimide (PSPI) layer; a controlled collapse chip connection (C4) bump overlying the PSPI layer; and a solder overlying the C4 bump and contacting a side of the C4 bump. The method can further include recessing a portion of the PSPI layer adjacent to the C4 bump to form a PSPI pedestal under the C4 bump. The method can additionally include forming an underfill abutting the PSPI pedestal and the C4 bump, wherein the underfill and the solder form an interface separated from the PSPI pedestal.