Inventors with similar research interests:
Location History:
- Richmond, MA (US) (2006)
- Charlotte, VT (US) (2012 - 2013)
- Essex Junction, VT (US) (2013 - 2014)
- Hinesburg, VT (US) (2008 - 2016)
- Richmond, VT (US) (2005 - 2017)
- Avon, CO (US) (2015 - 2017)
- Eagle, CO (US) (2018)
- Vail, CO (US) (2015 - 2019)
- Eagle-Vail, CO (US) (2015 - 2020)
- Burke, VT (US) (2016 - 2022)
Company Filing History:
138 out of 164,197 
21 out of 5,671 
2 out of 1,128 
Years Active: 2005-2024
Areas of Expertise:
Title: Innovator Spotlight: Wolfgang Sauter - Pioneering Semiconductor Structures
Introduction:
In the realm of semiconductor structures and innovative manufacturing methods, Wolfgang Sauter has made his mark. With a wealth of patents to his name, Sauter has been a key player in advancing interconnect bridge structures and solder confinement solutions. This article delves into his latest patents, career highlights, and notable collaborations, shedding light on his contributions to the field.
Latest Patents:
Wolfgang Sauter's latest patents demonstrate his mastery in designing partitioned substrates with interconnect bridge structures and conductive pillars for solder confinement. One groundbreaking invention is the "Partitioned Substrates with Interconnect Bridge." This technology revolutionizes the connectivity and physical design of semiconductor structures, creating a bridge between multiple substrates and chips. Another notable patent, "Conductive Pillar Shaped for Solder Confinement," introduces a novel connection design with a hollow core, allowing for efficient and reliable solder confinement.
Career Highlights:
With an impressive total of 162 patents, Wolfgang Sauter has a track record of continuous innovation. He has demonstrated exceptional expertise during his tenure at renowned companies such as IBM (International Business Machines Corporation) and GlobalFoundries Inc. His long-standing association with industry giants reflects the trust and recognition Sauter has garnered in his field.
Collaborations:
Sauter's innovative journey has been enriched by collaborations with esteemed professionals, including Christopher David Muzzy and Jeffrey P Gambino. These collaborations have undoubtedly played a crucial role in driving forward advancements in the field of semiconductor structures. By leveraging collective knowledge and expertise, Sauter and his coworkers have successfully delivered groundbreaking solutions that shape the future of the industry.
Conclusion:
Wolfgang Sauter's contributions to the world of semiconductor structures and manufacturing methods have positioned him as a pioneer in his field. His numerous patents, particularly in partitioned substrates with interconnect bridge structures and conductive pillars for solder confinement, demonstrate his unwavering commitment to pushing the boundaries of innovation. Alongside his notable career at IBM and GlobalFoundries Inc., Sauter's collaborations with industry experts further underscore the magnitude of his achievements. As the world continues to rely on advanced semiconductor technologies, Wolfgang Sauter's work stands as a testament to the remarkable contributions made by inventors and innovators in shaping our technological landscape.