The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Jan. 26, 2017
International Business Machines Corporation, Armonk, NY (US);
Anson J. Call, Poughkeepsie, NY (US);
Erwin B. Cohen, South Burlington, VT (US);
Dany Minier, Granby, CA;
Wolfgang Sauter, Vail, CO (US);
David B. Stone, Jericho, VT (US);
Eric W. Tremble, Jericho, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multi-chip module, and method of fabricating the multi-chip module. The multi-chip module includes: a substrate containing multiple wiring layers, each wiring layer having first pads on a top surface of the substrate and second pads on a bottom surface of the substrate, wherein the second pads include split pad and a conventional pad; a first solder ball in direct physical contact with a contiguous bottom surface of the conventional pad and connected to a next level of packaging under the conventional pad, wherein the first solder ball has a first height; and a second solder ball in direct physical contact with first and second sections of the split pad separated by a gap, wherein the second solder ball has a second height that is sufficiently less than the first height such that the second solder ball is not connected to the next level of packaging.