Dany Minier

Title: Dany Minier: Innovator in Photonic Chip Assembly

Introduction

Dany Minier is a notable inventor based in Granby, CA. He has made significant contributions to the field of photonic chip assembly, holding a total of 3 patents. His work focuses on innovative methods that enhance manufacturing processes in high-volume environments.

Latest Patents

Dany Minier's latest patents include a Fiber Attach Assembly and Test Automation approach. This invention is designed for assembling photonic chips with integrated optical fibers. The process involves placing a die on an assembly station, providing one or more optical fibers, and bonding them to the die. It also includes performing optical tests and severing the optical fibers while retaining a predetermined length for future assembly.

Another significant patent is the Split Ball Grid Array Pad for Multi-Chip Modules. This invention outlines a method for fabricating multi-chip modules that include a substrate with multiple wiring layers. The design features both conventional and split pads, allowing for efficient connections and packaging.

Career Highlights

Dany Minier is currently employed at International Business Machines Corporation (IBM). His role at IBM allows him to leverage his expertise in photonic technologies and contribute to cutting-edge innovations in the industry.

Collaborations

Throughout his career, Dany has collaborated with notable coworkers such as Anson Jay Call and Erwin B Cohen. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Dany Minier is a distinguished inventor whose work in photonic chip assembly has paved the way for advancements in manufacturing processes. His contributions to the field are marked by his innovative patents and collaborative efforts within the industry.