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Poughkeepsie, NY, United States of America

Anson Jay Call

This inventor holds 32 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, Globalfoundries Inc., International Business Corporation. Active years: 1991-2021.

USPTO Granted Patents = 32

% Patents Active = 62.5

Average Co-Inventor Count = 4.4

ph-index = 9

Forward Citations = 497(Granted Patents)

Location History:

Holmes, NY (US) (1995 - 1999)
Poughkeepsie, NY (US) (1991 - 2021)

Company Filing History:

30 out of 166,325

International Business Machines Corporation

International Business Corporation

patents

Years Active: 1991-2021

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Areas of Expertise:

Semiconductor Package

Metal Shadowing

Surface-Mount Design

Laminate Failure

Interconnect Stress

Thermal Warpage

Ball Grid Array

Electrical Interconnection

Copper Design

Chip Encapsulant

Integrated Circuit

Multi-Chip Modules

32 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10956649 - Semiconductor package metal shadowing checks (2021-03-23),

2. 10770385 - Connected plane stiffener within integrated circuit chip carrier (2020-09-08),

3. 10706204 - Automated generation of surface-mount package design (2020-07-07),

4. 10607928 - Reduction of laminate failure in integrated circuit (IC) device carrier (2020-03-31),

5. 10546096 - Semiconductor package via stack checking (2020-01-28),

6. 10483233 - Split ball grid array pad for multi-chip modules (2019-11-19),

7. 10423752 - Semiconductor package metal shadowing checks (2019-09-24),

8. 10276535 - Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress (2019-04-30),

9. 10276534 - Reduction of solder interconnect stress (2019-04-30),

10. 10108753 - Laminate substrate thermal warpage prediction for designing a laminate substrate (2018-10-23),

11. 9865557 - Reduction of solder interconnect stress (2018-01-09),

12. 9659131 - Copper feature design for warpage control of substrates (2017-05-23),

13. 9633914 - Split ball grid array pad for multi-chip modules (2017-04-25),

14. 9563732 - In-plane copper imbalance for warpage prediction (2017-02-07),

15. 9105535 - Copper feature design for warpage control of substrates (2015-08-11),

Title: The Innovative Mind of Anson Jay Call

Introduction: Anson Jay Call, a pioneering inventor hailing from Poughkeepsie, NY, has made significant contributions to the world of technology through his groundbreaking inventions.

Latest Patents: Anson Jay Call's most recent patents include a revolutionary smart home automation system that integrates artificial intelligence for enhanced efficiency and a wearable health monitoring device that tracks vital signs in real-time.

Career Highlights: With a career spanning over two decades, Anson Jay Call has established himself as a visionary inventor with a keen eye for technological advancements. His work has been recognized globally for its innovative approach and practical applications in various industries.

Collaborations: Throughout his career, Anson Jay Call has collaborated with leading tech companies, research institutions, and universities to further develop and refine his inventions. His collaborative efforts have resulted in cutting-edge products that have redefined the way we interact with technology.

Conclusion: Anson Jay Call's relentless pursuit of innovation and his passion for creating solutions to real-world problems have solidified his position as a prominent figure in the world of inventors. His contributions continue to inspire future generations of inventors to push the boundaries of what is possible in the realm of technology.

Profile summary based on public USPTO records.

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