The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2017

Filed:

Jun. 29, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Edmund Blackshear, Wappinger Falls, NY (US);

Anson Jay Call, Poughkeepsie, NY (US);

Vijayeshwar Das Khanna, Millwood, NY (US);

Douglas Oliver Powell, Endicott, NY (US);

David John Russell, Oswego, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); G06F 17/50 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5072 (2013.01); G06F 17/5009 (2013.01); H01L 23/145 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/562 (2013.01); G06F 2217/42 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An approach is provided in which a laminate substrate includes top layers, bottom layers, and a core layer. The top layers are positioned between the core layer and a top surface metallurgy (TSM) layer and include at least one top conductive layer. The bottom layers are positioned between the core layer and a bottom surface metallurgy (BSM) layer and include at least one bottom conductive layer includes a material void pattern that is based upon the top conductive layer and reduces warpage of the laminate substrate.


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