Endicott, NY, United States of America

Douglas Oliver Powell

This inventor holds 39 USPTO granted patents and 1 published patent application and 1 EPO patent, primarily in Electronic Substrates. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 1992-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Douglas Oliver Powell. Retrieved from https://idiyas.com/inventor/douglas-oliver-powell

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 39 

% Patents Active = 48.7

 

Average Co-Inventor Count = 4.1

ph-index = 12

Forward Citations = 732(Granted Patents)


Company Filing History:


Years Active: 1992-2020

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Areas of Expertise:
Warpage Control
Stacked Vias
Multilayered Interconnect
Copper Feature Design
Impedance Discontinuity
Liquid Crystalline Polymer
Integrated Circuit Packages
Printed Circuit Boards
Dielectric Structures
Conductive Substructures
Sacrificial Carrier Dicing
Z-Interconnections
39 patents (USPTO):Explore Patents

Title: **Douglas Oliver Powell: A Trailblazer in Laminate Structure Innovations**

Introduction

Douglas Oliver Powell, based in Endicott, NY, is a distinguished inventor known for his significant contributions to the field of laminate structures. With a remarkable portfolio that includes 39 patents, Powell has demonstrated a consistent drive towards innovation, particularly in reducing warpage in laminate designs.

Latest Patents

Among his latest inventions are two notable patents. The first, titled "Reduced-warpage laminate structure," involves a laminate structure comprising a conductive layer and a dielectric layer. This innovative design features a selectively patterned high-modulus dielectric material that effectively balances the differential stress between the conductive and dielectric layers to stiffen the laminate structure and minimize warpage. The second patent, "Copper feature design for warpage control of substrates," presents an approach where a laminate substrate is designed with top and bottom layers flanking a core layer. Each layer includes conductive materials, with a unique void pattern that mitigates warpage by synergizing with the top conductive layer.

Career Highlights

Douglas has made notable strides in his career, with impactful tenures at renowned companies such as International Business Machines Corporation (IBM) and Globalfoundries Inc. His experience in these companies has undoubtedly enriched his expertise and influenced his innovative endeavors in laminate technology.

Collaborations

Throughout his career, Powell has collaborated with talented professionals, including Voya Rista Markovich and David John Russell. Such collaborations have likely fostered a creative atmosphere that promotes the development of cutting-edge technologies in his field.

Conclusion

Douglas Oliver Powell not only exemplifies the spirit of innovation but also significantly contributes to advancements in laminate structures. His extensive patent portfolio and collaborative efforts mark him as a pivotal figure in this dynamic technological domain. As innovation continues to shape the future, Powell’s work remains at the forefront, paving the way for new developments and applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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