The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2020
Filed:
Feb. 07, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Mark C. Lamorey, Williston, VT (US);
Shidong Li, Poughkeepsie, NY (US);
Janak G. Patel, South Burlington, VT (US);
Douglas O. Powell, Endicott, NY (US);
David J. Russell, Owego, NY (US);
Peter Slota, Jr., Vestal, NY (US);
David B. Stone, Jericho, VT (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4846 (2013.01); H01L 21/4857 (2013.01); H01L 23/04 (2013.01); H01L 23/49805 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H05K 1/0271 (2013.01); H05K 3/10 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01); Y10T 29/49155 (2015.01);
Abstract
A laminate structure includes a conductive layer and a dielectric layer in contact with the conductive layer, the dielectric layer comprises a selectively patterned high-modulus dielectric material that balances a differential stress between the conductive layer and the dielectric layer to mechanically stiffen the laminate structure and reduce warpage.