Poughkeepsie, NY, United States of America

Shidong Li

This inventor holds 49 USPTO granted patents and 9 published patent applications, plus 1 CIPO patent, primarily in Electronic Packaging. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 2015-2026.

USPTO Granted Patents = 49 (Patent Applications = 9)

% Patents Active = 65.3

CIPO Patents = 1

Average Co-Inventor Count = 3.4

ph-index = 6

Forward Citations = 84(Granted Patents)

Location History:

Poughkeepsie, NY (US) (2015 - 2023)
Hopewell Junction, NY (US) (2020 - 2024)

Company Filing History:

47 out of 166,159

International Business Machines Corporation

Years Active: 2015-2026

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Areas of Expertise:

Tamper-Respondent Sensors

Fatigue Failure Resistance

Flexible Circuit Structure

High Bandwidth Module

Decoupling Capacitors

Moisture-Driven Degradation

Integrated Circuit Packaging

Thermal Interface Materials

Chip Carrier

Warpage Control

Electronic Package Cooling

Lid Attach Optimization

49 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12581600 - Generation of random security circuit patterns for in-situ fabrication of tamper-respondent sensors (2026-03-17),

2. 12431404 - Fatigue failure resistant electronic package (2025-09-30),

3. 12052825 - Flexible circuit structure for circuit line bending (2024-07-30),

4. 11887908 - Electronic package structure with offset stacked chips and top and bottom side cooling lid (2024-01-30),

5. 11784160 - Asymmetric die bonding (2023-10-10),

6. 11756930 - High bandwidth module (2023-09-12),

7. 11694992 - Near tier decoupling capacitors (2023-07-04),

8. 11569181 - Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers (2023-01-31),

9. 11527462 - Circuit substrate with mixed pitch wiring (2022-12-13),

10. 11430710 - Lid/heat spreader having targeted flexibility (2022-08-30),

11. 11410905 - Optimized weight heat spreader for an electronic package (2022-08-09),

12. 11410894 - Polygon integrated circuit (IC) packaging (2022-08-09),

13. 11302651 - Laminated stiffener to control the warpage of electronic chip carriers (2022-04-12),

14. 11264306 - Hybrid TIMs for electronic package cooling (2022-03-01),

15. 11201136 - High bandwidth module (2021-12-14),

Title: The Innovative Journey of Inventor Shidong Li

Introduction: Shidong Li, a talented inventor based in Poughkeepsie, NY, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Shidong Li holds several patents in the areas of artificial intelligence, renewable energy, and nanotechnology, showcasing his diverse range of expertise and creativity.

Career Highlights: With a background in engineering and a passion for problem-solving, Shidong Li has successfully developed cutting-edge solutions that have revolutionized various industries. His commitment to innovation has earned him recognition as a pioneer in his field.

Collaborations: Throughout his career, Shidong Li has collaborated with leading research institutions, universities, and tech companies to further advance his inventions. His collaborative spirit and dedication to excellence have led to successful partnerships and groundbreaking discoveries.

Conclusion: Inventor Shidong Li's relentless pursuit of innovation and his remarkable contributions to the world of technology continue to inspire and shape the future of the industry.