The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Nov. 13, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kamal K. Sikka, Poughkeepsie, NY (US);

Shidong Li, Hopewell Junction, NY (US);

Tuhin Sinha, Oradell, NJ (US);

Jeffrey Allen Zitz, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/345 (2013.01); H01L 23/49822 (2013.01);
Abstract

A chip package comprises a chip having a first temperature sensor. The first temperature sensor is configured to measure a first temperature of the chip in a localized area around the first temperature sensor. The chip package also includes a chip carrier coupled to the chip via a plurality of solder connections. The chip carrier includes a second temperature sensor vertically aligned with the first temperature sensor. The second temperature sensor is configured to measure a second temperature of the chip carrier in a localized area around the second temperature sensor. The chip carrier further includes a localized heater element located near the second temperature sensor and configured to generate heat in response to a detected difference based on comparison of the first temperature and the second temperature such that the detected difference is adjusted in the localized area around the first temperature sensor.


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