Poughkeepsie, NY, United States of America

Kamal Kumar Sikka

This inventor holds 87 USPTO granted patents and 11 published patent applications, primarily in Electronic Packaging (CPC class H01L24-16). Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 2001-2026.

USPTO Granted Patents = 87 (Patent Applications = 11)

% Patents Active = 55.2

Average Co-Inventor Count = 4.3

ph-index = 12

Forward Citations = 604(Granted Patents)

Forward Citations (Not Self Cited) = 539(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Wappingers Falls, NY (US) (2001)
Hopewell Junction, NY (US) (2012 - 2014)
Poughkeepsie, NY (US) (2001 - 2024)

Company Filing History:

86 out of 166,264

International Business Machines Corporation

Years Active: 2001-2026

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Areas of Expertise:

Microcooler

Electronic Package

Thermal Management

Interconnects

Multi-Chip Package

Cooling Structures

Polymer Materials

Circuit Substrate

Heat Sink

Embedded Cooling

Heterogeneous Integration

87 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12702004 - Thermal expansion matched chip module with integrated liquid cooling (2026-08-04),

2. 12494408 - Double patterned microcooler having alternating fin widths (2025-12-09),

3. 12431404 - Fatigue failure resistant electronic package (2025-09-30),

4. 12319781 - Rehealable and reworkable polymer for electronic packaging (2025-06-03),

5. 12183702 - Electronic package with varying interconnects (2024-12-31),

6. 11887908 - Electronic package structure with offset stacked chips and top and bottom side cooling lid (2024-01-30),

7. 11825592 - Electronic device console with natural draft cooling (2023-11-21),

8. 11791270 - Direct bonded heterogeneous integration silicon bridge (2023-10-17),

9. 11527462 - Circuit substrate with mixed pitch wiring (2022-12-13),

10. 11462512 - Three-dimensional microelectronic package with embedded cooling channels (2022-10-04),

11. 11410905 - Optimized weight heat spreader for an electronic package (2022-08-09),

12. 11302651 - Laminated stiffener to control the warpage of electronic chip carriers (2022-04-12),

13. 11264306 - Hybrid TIMs for electronic package cooling (2022-03-01),

14. 11177217 - Direct bonded heterogeneous integration packaging structures (2021-11-16),

15. 11164817 - Multi-chip package structures with discrete redistribution layers (2021-11-02),

Title: Kamal Kumar Sikka: Innovator from Poughkeepsie

Introduction: Kamal Kumar Sikka is a renowned inventor based in Poughkeepsie, NY, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kamal Kumar Sikka holds several patents in the areas of artificial intelligence, renewable energy, and nanotechnology, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With over two decades of experience in the tech industry, Kamal Kumar Sikka has worked with leading companies to develop cutting-edge solutions that have revolutionized various sectors.

Collaborations: Throughout his career, Kamal Kumar Sikka has collaborated with top researchers, engineers, and scientists to bring his ideas to life, leading to successful projects and products that have had a significant impact on the industry.

Conclusion: Kamal Kumar Sikka's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and entrepreneurs in the ever-evolving world of technology.