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For the Inventor, By the Inventor

Zhubei, Taiwan

Wensen Hung

USPTO Granted Patents = 70 

Average Co-Inventor Count = 3.0

ph-index = 12

Forward Citations = 350(Granted Patents)

Forward Citations (Not Self Cited) = 298(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsin-Chu, TW (2016)
  • Zhubei, TW (2014 - 2024)
  • Hsinchu County, TW (2018 - 2024)

Company Filing History:

goldMedal70 out of 40,674 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2025

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Areas of Expertise:
Semiconductor Packaging
3DIC Packaging
Thermal Management
Heat Dissipation Structures
Manufacturing Methods
Cooling Devices
Semiconductor Devices
Package Structure
Embedded Heat Dissipation
Die Cavity Interposer
Test Structures
Thermal Crosstalk
70 patents (USPTO):Explore Patents
1. 12387988 - Method of manufacturing semiconductor package having lid structure (2025-08-12),
2. 12354927 - Semiconductor device (2025-07-08),
3. 12272612 - Semiconductor package module and manufacturing methods thereof (2025-04-08),
4. 12170237 - Semiconductor structure and manufacturing method thereof (2024-12-17),
5. 12125757 - Semiconductor package with stiffener structure and method forming the same (2024-10-22),
6. 12094836 - Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof (2024-09-17),
7. 12074154 - Package structure (2024-08-27),
8. 12021006 - Package structure and method and equipment for forming the same (2024-06-25),
9. 11961779 - 3DIC packaging with hot spot thermal management features (2024-04-16),
10. 11929293 - Semiconductor package with lid structure (2024-03-12),
11. 11810833 - Package structure and method and equipment for forming the same (2023-11-07),
12. 11721602 - Semiconductor package with stiffener structure (2023-08-08),
13. 11715675 - Semiconductor device and manufacturing method thereof (2023-08-01),
14. 11594469 - Semiconductor device and method of manufacture (2023-02-28),
15. 11587845 - Semiconductor structure (2023-02-21),

Title: The Innovative Journey of Inventor Wensen Hung

Introduction: Wensen Hung, a talented inventor hailing from Zhubei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Wensen Hung's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a novel wearable device that monitors health metrics in real-time.

Career Highlights: Throughout his illustrious career, Wensen Hung has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His work has garnered international acclaim and has been instrumental in shaping the future of various industries.

Collaborations: Wensen Hung has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has led to the successful development and commercialization of several groundbreaking technologies.

Conclusion: In conclusion, Wensen Hung's passion for innovation and his relentless pursuit of excellence have established him as a trailblazer in the world of technology. His inventive spirit continues to inspire future generations of inventors to push the limits of what is possible.

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