Wensen Hung

This inventor holds 73 USPTO granted patents and 41 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2026.

USPTO Granted Patents = 73 (Patent Applications = 41)

% Patents Active = 90.4

Average Co-Inventor Count = 3.0

ph-index = 12

Forward Citations = 374(Granted Patents)

Forward Citations (Not Self Cited) = 298(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hsin-Chu, TW (2016)
Zhubei, TW (2014 - 2024)
Hsinchu County, TW (2018 - 2024)

Company Filing History:

73 out of 42,711

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2014-2026

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Areas of Expertise:

Semiconductor Package

Heat Dissipation

3DIC Packaging

Manufacturing Method

Stiffener Structure

Integrated Chip Package

Thermal Management

Cooling Devices

Crack-Resistant Lid

Embedded Heat Features

Perforated Foil Sheet

Semiconductor Structure

73 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12550775 - Semiconductor package with stiffener structure and method of manufacturing the same (2026-02-10),

2. 12550729 - Heat spreading device and method (2026-02-10),

3. 12538835 - Integrated chip package including a crack-resistant lid structure and methods of forming the same (2026-01-27),

4. 12387988 - Method of manufacturing semiconductor package having lid structure (2025-08-12),

5. 12354927 - Semiconductor device (2025-07-08),

6. 12272612 - Semiconductor package module and manufacturing methods thereof (2025-04-08),

7. 12170237 - Semiconductor structure and manufacturing method thereof (2024-12-17),

8. 12125757 - Semiconductor package with stiffener structure and method forming the same (2024-10-22),

9. 12094836 - Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof (2024-09-17),

10. 12074154 - Package structure (2024-08-27),

11. 12021006 - Package structure and method and equipment for forming the same (2024-06-25),

12. 11961779 - 3DIC packaging with hot spot thermal management features (2024-04-16),

13. 11929293 - Semiconductor package with lid structure (2024-03-12),

14. 11810833 - Package structure and method and equipment for forming the same (2023-11-07),

15. 11721602 - Semiconductor package with stiffener structure (2023-08-08),

Title: The Innovative Journey of Inventor Wensen Hung

Introduction: Wensen Hung, a talented inventor hailing from Zhubei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Wensen Hung's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a novel wearable device that monitors health metrics in real-time.

Career Highlights: Throughout his illustrious career, Wensen Hung has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. His work has garnered international acclaim and has been instrumental in shaping the future of various industries.

Collaborations: Wensen Hung has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has led to the successful development and commercialization of several groundbreaking technologies.

Conclusion: In conclusion, Wensen Hung's passion for innovation and his relentless pursuit of excellence have established him as a trailblazer in the world of technology. His inventive spirit continues to inspire future generations of inventors to push the limits of what is possible.