The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Dec. 18, 2022
International Business Machines Corporation, Armonk, NY (US);
Evan Colgan, Montvale, NJ (US);
Jae-Woong Nah, Closter, NJ (US);
Katsuyuki Sakuma, Fishkill, NY (US);
Kamal K. Sikka, Poughkeepsie, NY (US);
Joshua M. Rubin, Albany, NY (US);
Frank Robert Libsch, White Plains, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A chip and cooler assembly includes an active or passive interposer that has a front side and a back side. Integrated circuit chips are mounted onto the back side of the interposer. Each of the chips has a front side that is attached to the interposer and a back side that faces away from the interposer. Gaps separate the chips. The assembly also includes a frame that is fitted into the gaps between the chips. The frame is CTE-matched to the chips. The frame and the chips define a back side surface. A cooler module is attached to the back side surface. The cooler module is CTE-matched to the chips. The cooler module includes a microchannel cooler that is disposed directly against the back sides of the chips and a manifold that is attached to the microchannel cooler opposite the chips. The manifold is CTE-matched to the microchannel cooler.