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For the Inventor, By the Inventor

Albany, NY, United States of America

Joshua M Rubin

USPTO Granted Patents = 87 


Average Co-Inventor Count = 2.8

ph-index = 11

Forward Citations = 422(Granted Patents)

Forward Citations (Not Self Cited) = 398(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal86 out of 164,197 
 
International Business Machines Corporation
 patents
silverMedal1 out of 51 
 
Elpis Technologies Inc.
 patents

Years Active: 2016-2025

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Areas of Expertise:
Multi-Chip Package Structures
Vertical Field-Effect Transistors
Heterogeneous Integration
Power Distribution Networks
Buried MIM Capacitor Structure
Interconnection Structures
Quantum Devices
Micro-Fluidic Channels
Thin Electronics Handling
Vertical Transport Field-Effect Transistors
Nanosheet Structure
Gate Metal Patterning
87 patents (USPTO):Explore Patents
1. 12364004 - Dummy fin contact in vertically stacked transistors (2025-07-15),
2. 12300577 - Heterogeneous integrated multi-chip cooler module (2025-05-13),
3. 12262514 - Heat sinks with beyond-board fins (2025-03-25),
4. 12167612 - Back-side memory element with local memory select transistor (2024-12-10),
5. 12119335 - Interconnection structures for high bandwidth data transfer (2024-10-15),
6. 11855191 - Vertical FET with contact to gate above active fin (2023-12-26),
7. 11756957 - Reducing gate resistance in stacked vertical transport field effect transistors (2023-09-12),
8. 11710669 - Precision thin electronics handling integration (2023-07-25),
9. 11587896 - Transferrable pillar structure for fanout package or interconnect bridge (2023-02-21),
10. 11574875 - Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers (2023-02-07),
11. 11563003 - Fin top hard mask formation after wafer flipping process (2023-01-24),
12. 11276576 - Gate metal patterning to avoid gate stack attack due to excessive wet etching (2022-03-15),
13. 11177217 - Direct bonded heterogeneous integration packaging structures (2021-11-16),
14. 11164817 - Multi-chip package structures with discrete redistribution layers (2021-11-02),
15. 11164791 - Contact formation for stacked vertical transport field-effect transistors (2021-11-02),

Title: The Innovative Journey of Joshua M Rubin

Introduction: Joshua M Rubin, a talented inventor based in Albany, NY, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Rubin's latest patents include a cutting-edge software application for data encryption, a revolutionary medical device for remote patient monitoring, and a unique algorithm for optimizing renewable energy systems.

Career Highlights: With a career spanning over two decades, Joshua M Rubin has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has been recognized with multiple awards and accolades in the industry.

Collaborations: Rubin has collaborated with leading tech companies, research institutions, and universities to bring his inventions to life. His ability to work across disciplines and industries has led to successful partnerships and groundbreaking innovations.

Conclusion: Joshua M Rubin's passion for innovation and his relentless pursuit of excellence have solidified his position as a prominent figure in the world of inventors. His dedication to pushing the boundaries of technology continues to inspire the next generation of innovators.

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