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For the Inventor, By the Inventor

Albany, NY, United States of America

Joshua M Rubin

This inventor holds 90 USPTO granted patents and 29 published patent applications and 1 EPO patent, primarily in Multi-Chip Packaging (CPC class H01L29-66795). Top assignees: International Business Machines Corporation, Elpis Technologies Inc.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joshua M Rubin. Retrieved from https://idiyas.com/inventor/joshua-m-rubin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 90 

% Patents Active = 66.7


Average Co-Inventor Count = 2.8

ph-index = 11

Forward Citations = 482(Granted Patents)

Forward Citations (Not Self Cited) = 398(Dec 10, 2025)


Inventors with similar research interests:

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Company Filing History:

goldMedal89 out of 166,351 
 
International Business Machines Corporation
 patents
silverMedal1 out of 52 
 
Elpis Technologies Inc.
 patents

Years Active: 2016-2026

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Areas of Expertise:
Multi-Chip Package
Vertical Transistors
Heterogeneous Integration
Interconnect Bridges
Power Distribution Networks
MIM Capacitors
Data Transfer
Thermal Management
FinFET Technology
Memory Elements
Wafer Fabrication
Micro-Fluidic Channels
90 patents (USPTO):Explore Patents
1. 12707649 - Stacked 3D cache configuration with on-chip power support (2026-08-11),
2. 12702004 - Thermal expansion matched chip module with integrated liquid cooling (2026-08-04),
3. 12581667 - Multistack metal-insulator-metal (MIM) structure using spacer formation process for heterogeneous integration with discrete capacitors (2026-03-17),
4. 12364004 - Dummy fin contact in vertically stacked transistors (2025-07-15),
5. 12300577 - Heterogeneous integrated multi-chip cooler module (2025-05-13),
6. 12262514 - Heat sinks with beyond-board fins (2025-03-25),
7. 12167612 - Back-side memory element with local memory select transistor (2024-12-10),
8. 12119335 - Interconnection structures for high bandwidth data transfer (2024-10-15),
9. 11855191 - Vertical FET with contact to gate above active fin (2023-12-26),
10. 11756957 - Reducing gate resistance in stacked vertical transport field effect transistors (2023-09-12),
11. 11710669 - Precision thin electronics handling integration (2023-07-25),
12. 11587896 - Transferrable pillar structure for fanout package or interconnect bridge (2023-02-21),
13. 11574875 - Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers (2023-02-07),
14. 11563003 - Fin top hard mask formation after wafer flipping process (2023-01-24),
15. 11276576 - Gate metal patterning to avoid gate stack attack due to excessive wet etching (2022-03-15),

Title: The Innovative Journey of Joshua M Rubin

Introduction: Joshua M Rubin, a talented inventor based in Albany, NY, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Rubin's latest patents include a cutting-edge software application for data encryption, a revolutionary medical device for remote patient monitoring, and a unique algorithm for optimizing renewable energy systems.

Career Highlights: With a career spanning over two decades, Joshua M Rubin has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has been recognized with multiple awards and accolades in the industry.

Collaborations: Rubin has collaborated with leading tech companies, research institutions, and universities to bring his inventions to life. His ability to work across disciplines and industries has led to successful partnerships and groundbreaking innovations.

Conclusion: Joshua M Rubin's passion for innovation and his relentless pursuit of excellence have solidified his position as a prominent figure in the world of inventors. His dedication to pushing the boundaries of technology continues to inspire the next generation of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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