The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Nov. 15, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Arvind Kumar, Chappaqua, NY (US);
Todd Edward Takken, Brewster, NY (US);
John W Golz, Hopewell Jct, NY (US);
Joshua M. Rubin, Albany, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H10B 80/00 (2026.01); H10W 72/20 (2026.01); H10W 90/00 (2026.01); H10W 90/20 (2026.01); H10W 90/26 (2026.01);
U.S. Cl.
CPC ...
H10B 80/00 (2023.02); H10W 90/00 (2026.01); H10W 72/20 (2026.01); H10W 90/26 (2026.01); H10W 90/288 (2026.01); H10W 90/297 (2026.01); H10W 90/722 (2026.01);
Abstract
A semiconductor module includes a first semiconductor die, which comprises (i) a power support structure and (ii) a first cache region; and a second semiconductor die, which is mounted on top of the first semiconductor die and comprises (i) a logic core, which overlies and is electrically connected to the power support structure, and (ii) a second cache region, which overlies and is electrically connected to the first cache region.