This inventor holds 140 USPTO granted patents and 8 published patent applications and 3 EPO patents, primarily in Heterogeneous Integration (CPC class H01L29-517). Top assignees: International Business Machines Corporation, Globalfoundries Inc., Texas Instruments Corporation. Active years: 2001-2026.
Inventors with similar research interests:
Location History:
- New York, NY (US) (2001 - 2008)
- Ithaca, NY (US) (2003 - 2008)
- Hopewell Junction, NY (US) (2011 - 2014)
- Kadugodi, IN (2015)
- Beacon, NY (US) (2011 - 2021)
- Karawal Nagar, IN (2021)
- Bengaluru, IN (2014 - 2022)
- Chappaqua, NY (US) (2010 - 2023)
Company Filing History:
116 out of 166,209 
14 out of 5,671 
3 out of 29,845 
Years Active: 2001-2026
Areas of Expertise:
Title: Arvind Kumar: Pioneering Innovator in Integrated Circuits and Obfuscation Technologies
Introduction:
Arvind Kumar, a resident of Chappaqua, NY, has made significant contributions to the field of integrated circuits and obfuscation technologies. With an impressive portfolio of 130 patents, Arvind has created groundbreaking innovations that have advanced the semiconductor industry. In this article, we explore Arvind Kumar's latest patents, career highlights, notable collaborations, and his invaluable contributions to the field.
Latest Patents:
Arvind Kumar's expertise in circuit obfuscation has resulted in his latest patent, the "Tamper Resistant Obfuscation Circuit." This innovation leverages a tamper-resistant nonvolatile memory to encode a trusted Boolean function, enabling circuit obfuscation, data obfuscation, and IP block release. Arvind's breakthrough lies in utilizing a look-up table implemented as a cascaded multiplexer circuit to encode multiple obfuscation functions. The ability to reprogram these functions using a symmetric key protocol further enhances the security of the obfuscation circuit.
Another notable patent by Arvind Kumar is the "Precision Thin Electronics Handling Integration." This invention involves the arrangement of one or more die stacks on a redistribution layer (RDL) to create an electronic package. By including Through Silicon Via (TSV) dies, interpose layers, and testing circuitry, Arvind has revolutionized the manufacturing and testing methods for heterogenous integrated structures. This patent is particularly significant for large-scale applications, including wafer and panel-sized productions.
Career Highlights:
Arvind Kumar's illustrious career includes notable affiliations with leading technology companies. He has been involved with International Business Machines Corporation (IBM), a globally recognized industry pioneer. Additionally, Arvind has contributed to GlobalFoundries Inc., a semiconductor foundry company known for its cutting-edge technologies. His time at these esteemed organizations has allowed him to further refine his expertise and propel the semiconductor industry forward.
Collaborations:
Throughout his career, Arvind Kumar has had the privilege of collaborating with remarkable colleagues, including Anthony I Chou and Shreesh Narasimha. Their combined expertise and shared passion for innovation have laid the foundation for several groundbreaking advancements in integrated circuits and obfuscation technologies. Collaborative efforts between these industry professionals have undoubtedly pushed the boundaries of what is possible and resulted in game-changing inventions.
Conclusion:
Arvind Kumar's extensive patent portfolio and exceptional contributions to the field of integrated circuits and obfuscation technologies have solidified his position as an influential inventor and innovator. His expertise in circuit obfuscation and thin electronics handling integration has transformed the semiconductor industry, paving the way for enhanced security and advanced manufacturing methods. Through collaborations with esteemed colleagues, Arvind Kumar continues to shape the future of this rapidly evolving field.