The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
May. 10, 2021
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Mukta Ghate Farooq, Hopewell Jct, NY (US);
Arvind Kumar, Chappaqua, NY (US);
Ravi Nair, Briarcliff Manor, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/3675 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/08145 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01);
Abstract
A multichip module with a vertical stack of a logic chip, a translator chip, and at least one memory chip. The multichip module includes a logic chip, a translator chip over and vertically connecting to the logic chip, and at least one memory chip above and vertically connecting to the translator chip where the translator chip is one of a chip with active devices or a passive chip.