The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Jul. 20, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jean-Olivier Plouchart, New York, NY (US);

Dirk Pfeiffer, Croton on Hudson, NY (US);

Arvind Kumar, Chappaqua, NY (US);

Takashi Ando, Eastchester, NY (US);

Peilin Song, Lagrangeville, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); G06F 21/78 (2013.01); H04L 9/32 (2006.01);
U.S. Cl.
CPC ...
H01L 23/573 (2013.01); G06F 21/78 (2013.01); H01L 23/57 (2013.01); H04L 9/3278 (2013.01);
Abstract

A tamper-resistant memory is formed by placing a solid-state memory array between metal wiring layers in the upper portion of an integrated circuit (back-end of the line). The metal layers form a mesh that surrounds the memory array to protect it from picosecond imaging circuit analysis, side channel attacks, and delayering with electrical measurement. Interconnections between a memory cell and its measurement circuit are designed to protect each layer below, i.e., an interconnecting metal portion in a particular metal layer is no smaller than the interconnecting metal portion in the next lower layer. The measurement circuits are shrouded by the metal mesh. The substrate, metal layers and memory array are part of a single monolithic structure. In an embodiment adapted for a chip identification protocol, the memory array contains a physical unclonable function identifier that uniquely identifies the tamper-resistant integrated circuit, a symmetric encryption key and a release key.


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