The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Dec. 15, 2023
International Business Machines Corporation, Armonk, NY (US);
Qianwen Chen, Chappaqua, NY (US);
Joshua M. Rubin, Albany, NY (US);
Ruilong Xie, Niskayuna, NY (US);
Tao Li, Slingerlands, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electrical device that includes thermal cooling through silicon vias (TSVs) and micro-channels embedded in the carrier wafer for back side power distribution networks (BSPDN). The carrier wafer is at one end of a stacked structure providing the electrical device. At least one active device layer in the stacked structure that is present a level of the electrical device that is separate from a level containing the thermal cooling through silicon vias (TSVs) and micro-channels.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile