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For the Inventor, By the Inventor

Poughkeepsie, NY, United States of America

Jeffrey Allen Zitz

USPTO Granted Patents = 63 

Average Co-Inventor Count = 4.7

ph-index = 12

Forward Citations = 580(Granted Patents)

DiyaCoin DiyaCoin = 0.96 


Inventors with similar research interests:


Location History:

  • Hopewell Junction, NY (US) (2014)
  • Poughkeepsie, NY (US) (1995 - 2024)

Company Filing History:

goldMedal63 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1995-2025

where 'Filed Patents' based on already Granted Patents

63 patents (USPTO):
1. 12431404 - Fatigue failure resistant electronic package (2025-09-30),
2. 12028997 - Rotating lid for module cooler (2024-07-02),
3. 11800666 - Temporary removable module lid (2023-10-24),
4. 11264306 - Hybrid TIMs for electronic package cooling (2022-03-01),
5. 11158562 - Conformal integrated circuit (IC) device package lid (2021-10-26),
6. 11156409 - Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover (2021-10-26),
7. 10978314 - Multi integrated circuit chip carrier package (2021-04-13),
8. 10905029 - Cooling structure for electronic boards (2021-01-26),
9. 10892170 - Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader (2021-01-12),
10. 10842043 - Fabricating coolant-cooled heat sinks with internal thermally-conductive fins (2020-11-17),
11. 10757833 - Cooling structure for electronic boards (2020-08-25),
12. 10593564 - Lid attach optimization to limit electronic package warpage (2020-03-17),
13. 10566215 - Method of fabricating a chip module with stiffening frame and orthogonal heat spreader (2020-02-18),
14. 10542636 - Cooling structure for electronic boards (2020-01-21),
15. 10541156 - Multi integrated circuit chip carrier package (2020-01-21),

Title: Innovator Spotlight: Jeffrey Allen Zitz

Introduction: Meet Jeffrey Allen Zitz, a talented inventor based in Poughkeepsie, NY, with an impressive portfolio of 61 patents in various technological fields. His innovative spirit and dedication to advancing electronic module assemblies and semiconductor package cooling have made him a standout figure in the industry.

Latest Patents:

1. Temporary Removable Module Lid: Jeffrey's invention revolutionizes electronic module assemblies by introducing a removable lid with latches that securely fasten the lid to the assembly. This design ensures the protection and accessibility of the processors within the module.

2. Hybrid TIMs for Electronic Package Cooling: Through innovative structural combinations of Thermal Interface Materials (TIMs), Jeffrey's patent optimizes cooling in semiconductor packages. By strategically metallizing hot spots and utilizing high-performance TIMs, he enhances thermal management in electronic devices.

Career Highlights: Jeffrey Allen Zitz is a key contributor at IBM (International Business Machines Corporation), a renowned technology company renowned for its groundbreaking innovations in the industry. His expertise and creative approach to problem-solving have significantly impacted the development of cutting-edge technologies.

Collaborations: In his professional journey, Jeffrey has collaborated with esteemed colleagues such as Kamal Kumar Sikka and Hilton T Toy. Together, they have worked on pioneering projects that have pushed the boundaries of technological advancements in their respective fields.

Conclusion: Jeffrey Allen Zitz's inventive prowess and contributions to the realm of electronic module assemblies and semiconductor package cooling have solidified his position as a respected innovator within the industry. His relentless pursuit of excellence continues to inspire and drive innovation in the ever-evolving world of technology.

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