International Business Machines Corporation

Jeffrey Allen Zitz

Kamal Kumar Sikka

Hilton T Toy

Evan G Colgan

Sushumna Iruvanti

Shidong Li

Kenneth Charles Marston

Paul F Bodenweber

Frank Louis Pompeo

Randall Jason Werner

Yi Pan

Krishna R Tunga

Tuhin Sinha

Jiantao Zheng

Michael A Gaynes

Steven Paul Ostrander

William Louis Brodsky

John G Torok

Benjamin V Fasano

Patrick Anthony Coico

Virendra R Jadhav

Jay A Bunt

Hongqing Zhang

Marcus E Interrante

Suresh D Kadakia

David J Lewison

Martin Beaumier

Michael J Ellsworth, Jr

Mark Delorman Schultz

Jeffrey Donald Gelorme

Thomas J Brunschwiler

David L Questad

David L Edwards

Thomas Anthony Wassick

Noah B Singer

Gary Franklin Goth

Shawn Canfield

Lewis Sigmund Goldmann

John Harold Magerlein

Anson Jay Call

Gerd Schlottig

Yuet-Ying Yu

James H Covell

Jeffrey Thomas Coffin

Sundar M Kamath

Werner Escher

Ronald L Hering

Ingmar G Meijer

Joyce E Molinelli Acocella

Karl Joseph Puttlitz

Deborah Anne Sylvester

Marek Andrzej Orlowski

Stephen H Meisner

Kathryn R Lange

Lewis S Goldman

David Clifford Long

Robert L Wisnieff

Bruce Kenneth Furman

James John Kelly

Mario John Interrante

David James Alcoe

Peter Jeffrey Brofman

Stephan Paredes

Xiaojin Wei

Richard Francis Indyk

Amilcar R Arvelo

Randall Joseph Stutzman

William Edward Sablinski

Harvey Charles Hamel

Gaetano Paolo Messina

Brenda Lee Peterson

Renee L Weisman

Jamil A Wakil

Edward R Pillai

Taryn J Davis

Jason Scott Miller

Warren D Dyckman

Kathryn C Rivera

Wei Zou

Chenzhou Lian

Eric J Kastberg

Piyas Bal Chowdhury

Martin Witzig

Vladimir Jambrih

Megan J Shannon

Stephen Paredes

Mohamed Belazzouz

Christopher Todd Spring

Alain A Caron

A chip package comprises a chip having a first temperature sensor. The first temperature sensor is configured to measure a first temperature of the chip in a localized area around the first temperature sensor. The chip package also includes a chip carrier coupled to the chip via a plurality of solder connections. The chip carrier includes a second temperature sensor vertically aligned with the first temperature sensor. The second temperature sensor is configured to measure a second temperature of the chip carrier in a localized area around the second temperature sensor. The chip carrier further includes a localized heater element located near the second temperature sensor and configured to generate heat in response to a detected difference based on comparison of the first temperature and the second temperature such that the detected difference is adjusted in the localized area around the first temperature sensor.

Fatigue failure resistant electronic package

An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.

Rotating lid for module cooler

An electronic module assembly is provided. The electronic module assembly may include one or more processors mounted to a laminate, a top frame mounted to the laminate and surrounding the one or more processors, and a removable lid covering the one or more processors. The removable lid includes latches arranged along a perimeter of the removable lid, the latches engage with a lip of the top frame and secure the removable lid to the module assembly, and the removable lid can only be removed from the module assembly by releasing all of the latches.

Temporary removable module lid

Structural combinations of TIMs and methods of combining these TIMs in semiconductor packages are disclosed. An embodiment forms the structures by selectively metallizing a backside of a semiconductor chip (chip) on chip hot spots, placing a higher performance thermal interface material (TIM) on the metallized hot spots, selectively metalizing an underside of a lid in one or more metalized lid locations, and assembling a lid over the backside of the chip to create an assembly so that metalized lid locations are in contact with the higher performance TIMs. A lower performance TIM fills the region surrounding the higher performance TIM on the underside of the lid enclosing the chips. Disclosed are methods of disposing both solid and dispensable TIMs, curing and not curing the thermal interface, and structures to keep the TIMs in place while assembly the package and compressing dispensable TIMs. Alternative method steps are disclosed, such as: injecting the lower performance TIM through injection holes in a pre-assembled assembly, using solid preform TIMs with cutouts, and using high performance TIM structures that have collapsible rails to prevent lower performance TIM from spilling onto the surface of the higher performance TIM to permit good/bonding.

Hybrid TIMs for electronic package cooling

An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.

Conformal integrated circuit (IC) device package lid

Coolant-cooled heat sinks and methods of fabrication are provided with a coolant-carrying compartment between a cover and a heat transfer base. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. One or more grooves are provided in an interface surface of the cover and fins, and wicking element(s) are positioned within, at least in part, the groove(s). A joining material is provided between the cover and fins to join the plurality of thermally-conductive fins to the cover. The wicking element(s) within, at least in part, the groove(s) facilitate retaining the joining material over the plurality of thermally-conductive fins during joining of the cover and fins.

Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover

A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned against a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment features within the lid with one or more respective alignment features of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, the lid be loaded against respective IC chips, and the lid may be loaded against the carrier. While under compression, thermal interface material between respective the lid and respective IC chips and seal band material between the lid and the carrier may be cured.

Multi integrated circuit chip carrier package

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

Cooling structure for electronic boards

An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, a first directional heat spreader, and a second directional heat spreader. Presented herein is a fabrication method that includes attaching the stiffening frame to the carrier. The stiffening frame includes a central opening, a base portion, a first pair of opposing sidewalls, and a second pair of opposing sidewalls. The method includes electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening. The method includes thermally contacting the first directional heat spreader to the semiconductor chip. The first directional heat spreader transfers heat from the semiconductor chip towards the first pair of opposing sidewalls. The method includes thermally contacting the second directional heat spreader to the first directional heat spreader. The second directional heat spreader transfers heat from the first directional heat spreader towards the second pair of opposing sidewalls.

Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader

Methods of producing coolant-cooled heat sinks with a coolant-carrying compartment between a cover and a heat transfer base are provided. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. The method includes positioning a screen with openings over the plurality of thermally-conductive fins, between the plurality of thermally-conductive fins and the cover, and providing a joining material over the screen, between the screen and the cover. The method also includes joining the plurality of thermally-conductive fins to the cover across the screen using the joining material, where the screen facilitates retaining the joining material over the plurality of thermally-conductive fins during the joining.

Fabricating coolant-cooled heat sinks with internal thermally-conductive fins

An electronic package includes a carrier and a semiconductor chip. In a first aspect, a lid is attached to the chip and subsequently the gap between the lid and the carrier is filled by a seal band that includes seal band material and a plurality of shim members. In another aspect, an interleaved seal band includes a pattern of a first type of seal band material and a second type of seal band material. In another aspect, the lid includes a plurality of surfaces at different topographies to reduce the thickness of the seal band between the topographic lid and the carrier. In yet another aspect the electronic package further includes a frame concentric with the chip. The lid is attached to the frame with a solder, epoxy or elastomer and placed on the chip with a thermal interface material. The seal band material is dispensed on the chip carrier and the frame is then moved towards the chip carrier allowing a minimum seal band thickness.

Lid attach optimization to limit electronic package warpage

A method includes electrically connecting an IC chip module to a motherboard and thermally contacting a heat sink to the IC chip module. The IC chip module includes a carrier comprising a top surface and a bottom surface configured to be electrically connected to the motherboard. The IC chip module includes a stiffening frame attached to the carrier top surface. The stiffening frame includes a base portion that has a central opening and a plurality of opposing sidewalls. The IC chip module further includes a semiconductor chip electrically connected to the carrier top surface and concentrically arranged within the central opening. The IC chip module further includes a first directional heat spreader thermally contacting the semiconductor chip. The first directional heat spreader includes a directionally thermally conductive material arranged to efficiently transfer heat from the semiconductor chip in a first opposing bivector direction towards first opposing sidewalls.

Method of fabricating a chip module with stiffening frame and orthogonal heat spreader

A multi integrated circuit (IC) chip package includes multiple IC chips, a carrier, and a lid. The IC chips may be connected to the carrier. Alternatively, each IC chip may be connected to an interposer and multiple interposers may be connected to the carrier. The carrier may be positioned within a carrier deck. The lid may be positioned relative to carrier by aligning one or more alignment receptacles within the lid with one or more respective alignment protrusions of the carrier deck. A compression fixture cover may contact the lid and exert a force toward the carrier deck, respective lid pedestals may be loaded toward respective IC chips, and an integral lid foot may be loaded toward the carrier. While under compression, thermal interface material between respective lid pedestals and respective IC chips and seal band material between the integral foot and the carrier may be cured.

Growing community of inventors

Poughkeepsie, NY, United States of America

Jeffrey Allen Zitz