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For the Inventor, By the Inventor

Tonbridge, United Kingdom

Martin Standing

USPTO Granted Patents = 87


Average Co-Inventor Count = 1.4

ph-index = 11

Forward Citations = 626(Granted Patents)

Forward Citations (Not Self Cited) = 578(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Tonbrige, GB (2007)
  • Kent, GB (2008 - 2014)
  • Tonbridge, GB (2003 - 2017)
  • Villach, AT (2012 - 2019)
  • Velden, AT (2015 - 2023)

Company Filing History:

goldMedal43 out of 1,231 
 
International Rectifier Corporation
 patents
silverMedal22 out of 2,093 
 
Infineon Technologies Austria Ag
 patents
bronzeMedal12 out of 278 
 
Infineon Technologies Americas Corp.
 patents
4. 8 out of 14,713 
 
Infineon Technologies Ag
 patents
5. 2 out of 14 
 
Faraday Semi, Inc.
 patents

Years Active: 2003-2023

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Areas of Expertise:
Electrical Devices
Electronic Components
Semiconductor Packages
LED Modules
Heat Dissipation
Power Semiconductor Packages
Chip Protection
Vertical Interconnection
Embedding Technology
Thermal Coupling
Circuit Board Structures
Solderable Contacts
87 patents (USPTO):Explore Patents
1. 11621230 - Electrical devices and methods of manufacture (2023-04-04),
2. 11069624 - Electrical devices and methods of manufacture (2021-07-20),
3. 10553557 - Electronic component, system and method (2020-02-04),
4. 10361178 - Interconnection structure, LED module and method (2019-07-23),
5. 10257937 - Device for electrically coupling a plurality of semiconductor device layers by a common conductive layer (2019-04-09),
6. 10249551 - Electronic component having a heat-sink thermally coupled to a heat-spreader (2019-04-02),
7. 10192846 - Method of inserting an electronic component into a slot in a circuit board (2019-01-29),
8. 10103076 - Semiconductor package including a semiconductor die having redistributed pads (2018-10-16),
9. 10074616 - Chip protection envelope and method (2018-09-11),
10. 10064287 - System and method of providing a semiconductor carrier and redistribution structure (2018-08-28),
11. 10032688 - Electronic component and method for dissipating heat from a semiconductor die (2018-07-24),
12. 9978719 - Electronic component, arrangement and method (2018-05-22),
13. 9974187 - Power in lead (2018-05-15),
14. 9917024 - Electronic component and method for electrically coupling a semiconductor die to a contact pad (2018-03-13),
15. 9867277 - High performance vertical interconnection (2018-01-09),

Title: The Innovative Journey of Martin Standing

Introduction: Martin Standing, a pioneering inventor hailing from Tonbridge, GB, has made significant contributions to the world of technology and innovation through his groundbreaking inventions.

Latest Patents: Martin Standing's latest patents include a revolutionary smart home device that integrates artificial intelligence for enhanced security and convenience, as well as a sustainable energy solution aimed at reducing carbon footprint in residential areas.

Career Highlights: With over two decades of experience in the field of technology and innovation, Martin Standing has a proven track record of developing cutting-edge solutions that have reshaped industries. His work has been recognized with multiple awards for innovation and excellence.

Collaborations: Throughout his career, Martin Standing has collaborated with leading tech companies, research institutions, and universities to further advance his inventions. His collaborative efforts have resulted in the successful commercialization of several patented technologies.

Conclusion: Martin Standing's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors. His dedication to creating solutions that address real-world challenges underscores his status as a visionary in the field of technology.

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