The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2018
Filed:
Jan. 28, 2014
Infineon Technologies Austria Ag, Villach, AT;
Martin Standing, Villach, AT;
Infineon Technologies Austria AG, Villach, AT;
Abstract
A method includes applying solder paste to a portion of a circuit board, arranging a first contact pad of a first electronic component adjacent the layer of solder paste, the first electronic component comprising a dielectric layer, at least one semiconductor die embedded in the dielectric layer, the at least one first contact pad being electrically coupled to the semiconductor die and arranged on a lower side of the dielectric layer, and at least one second contact pad positioned on an upper side of the dielectric layer, and melting the solder paste to produce a molten solder that flows onto at least one of the first contact pad and the second contact pad of the first electronic component.