The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2018

Filed:

Oct. 18, 2012
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Martin Standing, Villach, AT;

Andrew Roberts, Wrexham, GB;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 23/538 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0207 (2013.01); H01L 23/5389 (2013.01); H05K 1/0265 (2013.01); H05K 1/186 (2013.01); H01L 2924/0002 (2013.01); H05K 3/429 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10416 (2013.01); H05K 2201/10492 (2013.01); H05K 2201/10515 (2013.01); Y10T 29/49128 (2015.01);
Abstract

Representative implementations of devices and techniques provide improved electrical performance of components, such as chip dice, for example, disposed on different layers of a multi-layer printed circuit board (PCB). In an example, the components may be embedded within layers of the PCB. An insulating layer located between two component layers or sets of layers includes a conductive portion that may be strategically located to provide electrical connectivity between the components. The conductive portion may also be arranged to improve thermal conductivity between points of the PCB.


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