The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Nov. 05, 2014
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Martin Standing, Velden, AT;
Marcus Pawley, Kelsall, GB;
Andrew Roberts, Denbigh, GB;
Robert Clarke, East Peckham, GB;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 24/72 (2013.01); H01L 23/3107 (2013.01); H01L 24/09 (2013.01); H05K 1/142 (2013.01); H01L 2224/06179 (2013.01); H01L 2924/1304 (2013.01); H05K 1/117 (2013.01); H05K 3/4644 (2013.01); H05K 3/4697 (2013.01); H05K 2201/0314 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/10409 (2013.01); Y10T 29/4913 (2015.01);
Abstract
In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board. The inserting the electronic component causes one or more electrically conductive contacts on one or more surfaces of the electronic component to electrically couple with one or more corresponding electrical contacts arranged on one or more surfaces of the slot.