International Rectifier Corporation

Infineon Technologies Austria Ag

Infineon Technologies Americas Corp.

Infineon Technologies Ag

Faraday Semi, Inc.

Martin Standing

Andrew Neil Sawle

Andrew P Roberts

Robert J Clarke

Hazel Deborah Schofield

Marcus Pawley

Mark Pavier

David Paul Jones

Martin Carroll

Matthew P Elwin

Ian Glenville Wagstaffe

Parviz Parto

Milko Paolucci

Johannes Schoiswohl

Ralf Otremba

Josef Hoeglauer

Paul Ganitzer

George Pearson

Andy Farlow

Kenneth McCartney

A die can be applied to a front conductive layer. Openings can be formed in the conductive layer over contact points on the die. The openings can be filled with a conductive material to electrically couple the conductive layer to the contact points on the die. The front conductive layer can be etched to form a first conductive pattern. Conductive standoffs can be formed on portions of the front conductive layer. An additional front conductive layer can be laminated onto the front side. Openings can be formed in the additional front conductive layer over the standoffs. The openings can be filled with a conductive material to electrically couple the additional conductive layer to the underlying standoffs. The additional conductive layer can be etched to form a second conductive pattern.

Electrical devices and methods of manufacture

In an embodiment, an electronic component includes a power semiconductor device embedded in a dielectric core layer and at least one contact layer protruding from a first side face of the dielectric core layer. The contact layer includes an electrically insulating layer and at least one contact pad arranged on the electrically insulating layer. The at least one contact pad is electrically coupled with the power semiconductor device.

Electronic component, system and method

In an embodiment, an interconnection structure includes a first semiconductor device including a conductive stud, a second device including a contact pad, an adhesive layer including an organic component arranged between a distal end of the conductive stud and the contact pad, the adhesive layer coupling the conductive stud to the contact pad, and a conductive layer extending from the conductive stud to the contact pad. The conductive layer has a melting point of at least 600&#xb0; C.

Interconnection structure, LED module and method

An assembly includes a first laminate electronic component and a second laminate electronic component. The first laminate electronic component includes a first dielectric layer, at least one first semiconductor die embedded in the first dielectric layer and at least one first contact pad including a first conductive via. The second laminate electronic component includes a second dielectric layer, at least one second semiconductor die embedded in the second dielectric layer and at least one second contact pad including a second conductive via. The first conductive via is electrically coupled to the second conductive via by a common conductive layer.

Device for electrically coupling a plurality of semiconductor device layers by a common conductive layer

An electronic component includes one or more semiconductor dice embedded in a first dielectric layer, a heat-spreader embedded in a second dielectric layer and a heat-sink thermally coupled to the heat-spreader. The heat-spreader has a higher thermal conductivity in directions substantially parallel to the major surface of the one or more semiconductor dice than in directions substantially perpendicular to the major surface of the one or more semiconductor dice. The heat-sink has a thermal conductivity in directions substantially perpendicular to the major surface of the one or more semiconductor dice that is higher than the thermal conductivity of the heat-spreader in directions substantially perpendicular to the major surface of the one or more semiconductor dice. The heat-spreader and the heat-sink provide a heat dissipation path from the one or more semiconductor dice having a lateral thermal resistance which increases with increasing distance from the one or more semiconductor devices.

Electronic component having a heat-sink thermally coupled to a heat-spreader

In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board. The inserting the electronic component causes one or more electrically conductive contacts on one or more surfaces of the electronic component to electrically couple with one or more corresponding electrical contacts arranged on one or more surfaces of the slot.

Method of inserting an electronic component into a slot in a circuit board

A method includes coupling a first major surface of a semiconductor die to a metallic body, depositing an insulation body over said semiconductor die, and removing a portion of said insulation body to expose a plurality of electrodes of said semiconductor die on a second major surface of said semiconductor die opposite said first surface. The method further includes forming a plurality of conductive pads over the plurality of electrodes, each conductive pad of said plurality of conductive pads providing an external connection for a respective one of said plurality of electrodes, wherein each conductive pad of said plurality of conductive pads has an area larger than an area of said respective one of said plurality of electrodes to which the respective conforming conductive pad of said plurality of conductive pads is coupled and extending over said insulation body.

Semiconductor package including a semiconductor die having redistributed pads

In an embodiment, a chip protection envelope includes a first dielectric layer including at least one organic component having a decomposition temperature of at least 180&#xb0; C., a semiconductor die embedded in the first dielectric layer, the semiconductor die having a first surface and a thickness t. A second dielectric layer is arranged on a first surface of the first dielectric layer, the second dielectric layer including a photodefinable polymer composition, and a conductive layer is arranged on the first surface of the semiconductor die and is electrically coupled to the semiconductor die. The conductive layer has a thickness t, wherein t&#x2265;t/3.

Chip protection envelope and method

In an embodiment, a method includes arranging a first carrier on a first major surface of a circuit board such that an electronic component arranged on the first carrier is positioned in an aperture in the circuit board and spaced apart from side walls of the aperture, and arranging a second carrier on a second major surface of the circuit board such that the second carrier covers the electronic component and the aperture, the second major surface of the circuit board opposing the first major surface of the circuit board. The electronic component includes a power semiconductor device embedded in a dielectric core layer and at least one contact pad arranged on a first major surface of the dielectric core layer.

System and method of providing a semiconductor carrier and redistribution structure

In an embodiment, an electronic component includes a dielectric core layer having a thickness, at least one semiconductor die embedded in the dielectric core layer and electrically coupled to at least one contact pad arranged on a first side of the dielectric core layer, and a heat dissipation layer arranged on a second side of the dielectric core layer and thermally coupled to the semiconductor die. The semiconductor die has a thickness that is substantially equal to, or greater than, or equal to the thickness of the dielectric core layer. The heat dissipation layer includes a material with a substantially isotropic thermal conductivity.

Electronic component and method for dissipating heat from a semiconductor die

A method includes applying solder paste to a portion of a circuit board, arranging a first contact pad of a first electronic component adjacent the layer of solder paste, the first electronic component comprising a dielectric layer, at least one semiconductor die embedded in the dielectric layer, the at least one first contact pad being electrically coupled to the semiconductor die and arranged on a lower side of the dielectric layer, and at least one second contact pad positioned on an upper side of the dielectric layer, and melting the solder paste to produce a molten solder that flows onto at least one of the first contact pad and the second contact pad of the first electronic component.

Electronic component, arrangement and method

Representative implementations of devices and techniques provide off-board power conversion. A power cable is arranged to distribute power from a power supply to a peripheral component. An active circuit is integrated into the cable, converting the power en route from the power supply to the peripheral component.

Power in lead

In an embodiment, an electronic component includes a dielectric core layer, one or semiconductor dies comprising a first major surface, a first electrode arranged on the first major surface and a second major surface that opposes the first major surface. One or more slots are arranged within the dielectric core layer adjacent the semiconductor die and a redistribution structure electrically couples the first electrode to a component contact pad arranged adjacent the second major surface of the semiconductor die. The semiconductor die is embedded in the dielectric core layer and a portion of the redistribution structure is arranged on side walls of the slot.

Electronic component and method for electrically coupling a semiconductor die to a contact pad

Representative implementations of devices and techniques provide improved electrical performance of components, such as chip dice, for example, disposed on different layers of a multi-layer printed circuit board (PCB). In an example, the components may be embedded within layers of the PCB. An insulating layer located between two component layers or sets of layers includes a conductive portion that may be strategically located to provide electrical connectivity between the components. The conductive portion may also be arranged to improve thermal conductivity between points of the PCB.

Growing community of inventors

Tonbridge, United Kingdom

Martin Standing