The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Jul. 07, 2014
Infineon Technologies Austria Ag, Villach, AT;
Martin Standing, Villach, AT;
Andrew Roberts, Denbigh, GB;
Infineon Technologies Austria AG, Villach, AT;
Abstract
An assembly includes a first laminate electronic component and a second laminate electronic component. The first laminate electronic component includes a first dielectric layer, at least one first semiconductor die embedded in the first dielectric layer and at least one first contact pad including a first conductive via. The second laminate electronic component includes a second dielectric layer, at least one second semiconductor die embedded in the second dielectric layer and at least one second contact pad including a second conductive via. The first conductive via is electrically coupled to the second conductive via by a common conductive layer.