The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 2021
Filed:
Jan. 09, 2020
International Business Machines Corporation, Armonk, NY (US);
Kamal K. Sikka, Poughkeepsie, NY (US);
Jon A. Casey, Poughkeepsie, NY (US);
Joshua Rubin, Albany, NY (US);
Arvind Kumar, Chappaqua, NY (US);
Dinesh Gupta, Hopewell Junction, NY (US);
Charles L. Arvin, Poughkeepsie, NY (US);
Mark W. Kapfhammer, Poughkeepsie, NY (US);
Steve Ostrander, Poughkeepsie, NY (US);
Maryse Cournoyer, Québec, CA;
Valérie A. Oberson, St-Alphonse de Granby, CA;
Lawrence A. Clevenger, Saratoga Springs, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.