Valérie Anne Oberson

Title: Innovator Profile: Valérie Anne Oberson

Introduction

Valérie Anne Oberson, an accomplished inventor based in St-Alphonse de Granby, Canada, has made significant contributions to the field of semiconductor packaging. With a total of five patents to his name, Oberson's work showcases innovative solutions that address complex challenges in technology and engineering.

Latest Patents

Oberson's latest inventions include the patent for "Direct Bonded Heterogeneous Integration Packaging Structures." This innovative technology encompasses a packaging substrate designed with first and second opposing surfaces. A trench or pedestal is featured in the first surface, along with a bridge that is placed either in the trench or adjacent to the pedestal sidewall. The bridge's upper surface is coplanar with the first surface of the package substrate. This configuration allows for at least two chips, arranged side by side, to overlie the bridge and substrate, with the bridge supporting the peripheral edges of these chips. Furthermore, a plurality of electric connections on the chips is directly coupled to corresponding electrical connections on both the bridge and the packaging substrate.

Career Highlights

Throughout his professional journey, Valérie Anne Oberson has been associated with prominent companies, including International Business Machines Corporation (IBM) and Ultratech, Inc. His involvement in these organizations has allowed him to refine his expertise and contribute to groundbreaking advancements in packaging technology.

Collaborations

Oberson has collaborated with notable peers, including Kamal Kumar Sikka and Jon Alfred Casey. Their collective efforts in innovative projects underscore the importance of teamwork in driving technological progress and enhancing product development.

Conclusion

Valérie Anne Oberson exemplifies the spirit of innovation within the semiconductor industry. His unique approach to packaging structures and processes highlights the vital role inventors play in shaping the future of technology. With several patents to his name, Oberson continues to pave the way for advancements that improve performance and efficiency in electronic devices.