The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2008
Filed:
Feb. 01, 2005
Luc Bélanger, Canton de Granby, CA;
Peter A. Gruber, Mohegan Lake, NY (US);
Valérie Oberson, Québec, CA;
Christopher L. Tessler, Poughquag, NY (US);
Luc Bélanger, Canton de Granby, CA;
Peter A. Gruber, Mohegan Lake, NY (US);
Valérie Oberson, Québec, CA;
Christopher L. Tessler, Poughquag, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately or together and use either formic acid vapor or partial concentration of hydrogen, both in nitrogen, as the oxide reducing atmosphere. A final embodiment produces fluxless transfer and reflow in only nitrogen through the use of ultrasonic vibration between the solder filled mold plate and solder receiving substrate.