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For the Inventor, By the Inventor

Poughquag, NY, United States of America

Christopher Lee Tessler

This inventor holds 21 USPTO granted patents and 8 published patent applications, primarily in Integrated Circuit Packaging. Top assignees: International Business Machines Corporation, Globalfoundries Inc., Suss Microtec Photonic Systems Inc.. Active years: 1997-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Christopher Lee Tessler. Retrieved from https://idiyas.com/inventor/christopher-lee-tessler

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 21 

% Patents Active = 47.6

Average Co-Inventor Count = 4.7

ph-index = 5

Forward Citations = 117(Granted Patents)


Location History:

  • Campbell Hall, NY (US) (1997 - 2016)
  • Poughquag, NY (US) (2008 - 2019)

Company Filing History:

goldMedal18 out of 166,409 
 
International Business Machines Corporation
 patents
silverMedal3 out of 5,671 
 
Globalfoundries Inc.
 patents
bronzeMedal2 out of 7 
 
Suss Microtec Photonic Systems Inc.
 patents
4. 1 out of 4 
 
Suss Microtec Inc.
 patents
where one patent can have more than one assignee

Years Active: 1997-2019

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Areas of Expertise:
Integrated Circuit
Glass Interposers
Solder Transfer
Multichip Module
Barrier Layer
Dispensing Assembly
Laser Ablation
Thermal Expansion
Pressure Valving
Vacuum Pressure Chamber
Dicing Channels
Fluxless Solder
21 patents (USPTO):Explore Patents
1. 10446442 - Integrated circuit chip with molding compound handler substrate and method (2019-10-15),
2. 10090255 - Dicing channels for glass interposers (2018-10-02),
3. 9754823 - Substrate including selectively formed barrier layer (2017-09-05),
4. 9748135 - Substrate including selectively formed barrier layer (2017-08-29),
5. 9278401 - Fill head interface with combination vacuum pressure chamber (2016-03-08),
6. 9254533 - Removing material from defective opening in glass mold (2016-02-09),
7. 8800952 - Removing material from defective opening in glass mold and related glass mold for injection molded solder (2014-08-12),
8. 8237086 - Removing material from defective opening in glass mold (2012-08-07),
9. 8123089 - Dispensing assembly with an injector controlled gas environment (2012-02-28),
10. 8123088 - Dispensing assembly with a controlled gas environment (2012-02-28),
11. 7833897 - Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface (2010-11-16),
12. 7513410 - Air bearing gap control for injection molded solder heads (2009-04-07),
13. 7401637 - Pressure-only molten metal valving apparatus and method (2008-07-22),
14. 7332424 - Fluxless solder transfer and reflow process (2008-02-19),
15. 6973715 - Method of forming a multichip module having chips on two sides (2005-12-13),

Title: The Innovative Journey of Christopher Lee Tessler

Introduction: Christopher Lee Tessler, a talented inventor hailing from Poughquag, NY, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: Christopher Lee Tessler's latest patents include a cutting-edge virtual reality headset that has revolutionized the gaming industry, a patented smart home device that enhances security measures, and a unique medical device designed to improve patient care.

Career Highlights: With a career spanning over two decades, Christopher Lee Tessler has established himself as a visionary inventor. His innovative solutions have garnered recognition in various industries, from healthcare to consumer electronics.

Collaborations: Throughout his career, Christopher Lee Tessler has collaborated with leading tech companies, research institutions, and universities to bring his inventions to life. His partnerships have led to the development of groundbreaking technologies that have shaped the future of innovation.

Conclusion: Christopher Lee Tessler's passion for innovation and dedication to pushing the boundaries of technology have solidified his position as a respected inventor in the industry. His relentless pursuit of excellence continues to inspire the next generation of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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