The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2017

Filed:

Aug. 18, 2015
Applicants:

International Business Machines Corporation, Armonk, NY (US);

Suss Microtec Photonic Systems Inc., Corona, CA (US);

Inventors:

Yuri M. Brovman, Larchmont, NY (US);

Brian M. Erwin, Lagrangeville, NY (US);

Nicholas A. Polomoff, White Plains, NY (US);

Jennifer D. Schuler, Wappingers Falls, NY (US);

Matthew E. Souter, Tustin, CA (US);

Christopher L. Tessler, Poughquag, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76841 (2013.01); H01L 21/7684 (2013.01); H01L 21/7685 (2013.01); H01L 21/76825 (2013.01); H01L 21/76837 (2013.01); H01L 21/76865 (2013.01); H01L 21/76877 (2013.01); H01L 21/76883 (2013.01);
Abstract

A method of selectively locating a barrier layer on a substrate includes forming a barrier layer on a surface of the substrate. The barrier layer comprises of a metal element and a non-metal element. The barrier layer may also be formed from a metal element and non-metal element. The method further includes forming an electrically conductive film layer on the barrier layer, and forming a metallic portion in the electrically conductive film layer. The method further includes selectively ablating portions of the barrier layer from the dielectric layer to selectively locate place the barrier layer on the substrate.


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