The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Mar. 28, 2012
Jerome D. Cohen, Poughquag, NY (US);
Robert G. Haas, Wappingers Falls, NY (US);
Enrico Herz, Frauendorf, DE;
Michael Teich, Moritzburg, DE;
Christopher L. Tessler, Poughquag, NY (US);
Jerome D. Cohen, Poughquag, NY (US);
Robert G. Haas, Wappingers Falls, NY (US);
Enrico Herz, Frauendorf, DE;
Michael Teich, Moritzburg, DE;
Christopher L. Tessler, Poughquag, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.