The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2009
Filed:
Jun. 11, 2007
Glen N. Biggs, Wappingers Falls, NY (US);
Timothy J. Chainer, Putnam Valley, NY (US);
John P. Karidis, Ossining, NY (US);
Dennis G. Manzer, Bedford Hills, NY (US);
Christopher L. Tessler, Poughquag, NY (US);
Glen N. Biggs, Wappingers Falls, NY (US);
Timothy J. Chainer, Putnam Valley, NY (US);
John P. Karidis, Ossining, NY (US);
Dennis G. Manzer, Bedford Hills, NY (US);
Christopher L. Tessler, Poughquag, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.