The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2005
Filed:
Dec. 03, 2003
Ajay Prabhakar Giri, Poughkeepsie, NY (US);
Joseph Michael Sullivan, Wappingers Falls, NY (US);
Christopher Lee Tessler, Campbell Hall, NY (US);
Ajay Prabhakar Giri, Poughkeepsie, NY (US);
Joseph Michael Sullivan, Wappingers Falls, NY (US);
Christopher Lee Tessler, Campbell Hall, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of forming a multichip module in which a thin film structure is formed on a temporary carrier and then an electrically insulating frame is attached to the thin film structure. A semiconductor device is attached to the thin film structure and then the temporary carrier is removed. Lastly, at least one semiconductor device is attached to the other side of the thin film structure. There is interconnectvity through the thin film structure between the semiconductor devices and the frame.