Poughkeepsie, NY, United States of America

Ajay Prabhakar Giri

This inventor holds 21 USPTO granted patents, primarily in Thin-Film Packaging. Top assignees: International Business Machines Corporation, Ultratech, Inc.. Active years: 1992-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ajay Prabhakar Giri. Retrieved from https://idiyas.com/inventor/ajay-prabhakar-giri

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21

% Patents Active = 76.2

Average Co-Inventor Count = 5.8

ph-index = 10

Forward Citations = 230(Granted Patents)

Company Filing History:

20 out of 166,351

International Business Machines Corporation

Years Active: 1992-2012

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Areas of Expertise:

Flip-Chip Interconnections

Lead-Free Solders

Multichip Modules

Thin-Film Structures

Corrosion-Resistant Pads

Uniform Plating Thickness

High Frequency Applications

Adhesion Promoting Layer

Dielectric Composite Substrate

Laser Exposure

Thin Film Capacitors

21 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8314500 - Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers (2012-11-20),

2. 8003512 - Structure of UBM and solder bumps and methods of fabrication (2011-08-23),

3. 7932169 - Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers (2011-04-26),

4. 6973715 - Method of forming a multichip module having chips on two sides (2005-12-13),

5. 6896784 - Method for controlling local current to achieve uniform plating thickness (2005-05-24),

6. 6890413 - Method and apparatus for controlling local current to achieve uniform plating thickness (2005-05-10),

7. 6765152 - Multichip module having chips on two sides (2004-07-20),

8. 6678949 - Process for forming a multi-level thin-film electronic packaging structure (2004-01-20),

9. 6451155 - Method using a thin adhesion promoting layer for bonding silicone elastomeric material to nickel and use thereof in making a heat sink assembly (2002-09-17),

10. 6291272 - Structure and process for making substrate packages for high frequency application (2001-09-18),

11. 6281452 - Multi-level thin-film electronic packaging structure and related method (2001-08-28),

12. 6261467 - Direct deposit thin film single/multi chip module (2001-07-17),

13. 6235412 - Corrosion-resistant terminal metal pads for thin film packages (2001-05-22),

14. 6083375 - Process for producing corrosion-resistant terminal metal pads for thin (2000-07-04),

15. 6037044 - Direct deposit thin film single/multi chip module (2000-03-14),

Title: Ajay Prabhakar Giri: Innovator Extraordinaire

Introduction: Ajay Prabhakar Giri is a renowned inventor based in Poughkeepsie, NY, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Ajay Prabhakar Giri holds several patents in the areas of artificial intelligence, renewable energy, and nanotechnology, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Ajay Prabhakar Giri has worked with leading tech companies, research institutions, and universities, consistently pushing the boundaries of what is possible in the world of inventions.

Collaborations: Throughout his career, Ajay Prabhakar Giri has collaborated with top scientists, engineers, and researchers from around the globe, fostering a culture of innovation and creativity in all his projects.

Conclusion: Ajay Prabhakar Giri's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]