The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2002
Filed:
Oct. 24, 1996
Applicant:
Inventors:
Hilton T. Toy, Wappingers Falls, NY (US);
David L. Edwards, Poughkeepsie, NY (US);
Da-Yuan Shih, Poughkeepsie, NY (US);
Ajay P. Giri, Poughkeepsie, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J / ;
U.S. Cl.
CPC ...
C09J / ;
Abstract
A heat sink assembly and method for attaching a multi-chip module cap to a polymeric heat sink adhesive by means of a thin adhesion-promoting metal film layer, which provides an interfacial bond between the cap and polymeric adhesive meeting package performance and reliability requirements. There is also a method of promoting adhesion between a silicon-containing polymeric adhesive and a metal surface using the thin adhesion-promoting metal film layer and the products thereof.