The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2024
Filed:
Dec. 21, 2021
International Business Machines Corporation, Armonk, NY (US);
Kamal K. Sikka, Poughkeepsie, NY (US);
Charles Leon Arvin, Poughkeepsie, NY (US);
Thomas Edward Lombardi, Poughkeepsie, NY (US);
Piyas Bal Chowdhury, Mountain View, CA (US);
Alfred Grill, White Plains, NY (US);
Steven Lorenz Wright, Tucson, AZ (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A flip chip device and methods for fabrication are provided. An interconnect layer for a device include a plurality of solder bumps arranged within the interconnect layer. A first subset of the plurality of solder bumps has a first cross-sectional area, where the first subset is arranged along a first position at a first edge of the interconnect layer. A second subset of the plurality of solder bumps has a second cross-sectional area, where the second subset is arranged at a second position of the interconnect layer. A third subset of the plurality of solder bumps is arranged between the first position and the second position, where the third subset has a plurality of cross-sectional areas.