Piyas Bal Chowdhury

Title: Innovations of Piyas Bal Chowdhury

Introduction

Piyas Bal Chowdhury is a notable inventor based in Mountain View, California. He has made significant contributions to the field of electronic packaging, holding two patents that showcase his innovative approach to technology.

Latest Patents

His latest patents include "Electronic package with varying interconnects" and "Hybrid TIMs for electronic package cooling." The first patent describes a flip chip device and methods for fabrication, featuring an interconnect layer with multiple solder bumps arranged in specific configurations. This design enhances the performance and reliability of electronic devices. The second patent focuses on structural combinations of thermal interface materials (TIMs) in semiconductor packages. It outlines methods for selectively metallizing semiconductor chips and lids to improve thermal management, ensuring efficient cooling of electronic components.

Career Highlights

Piyas Bal Chowdhury is currently employed at International Business Machines Corporation (IBM), where he continues to push the boundaries of innovation in electronic packaging. His work has been instrumental in developing advanced technologies that enhance the performance of electronic devices.

Collaborations

Throughout his career, Piyas has collaborated with esteemed colleagues, including Kamal Kumar Sikka and Charles Leon Arvin. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Piyas Bal Chowdhury's contributions to the field of electronic packaging through his patents and work at IBM highlight his role as a leading inventor. His innovative solutions are paving the way for advancements in technology and improving the efficiency of electronic devices.