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For the Inventor, By the Inventor

Oradell, NJ, United States of America

Tuhin Sinha

USPTO Granted Patents = 21 

Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 26(Granted Patents)


Location History:

  • Hackensack, NJ (US) (2018 - 2020)
  • Oradell, NJ (US) (2017 - 2022)

Company Filing History:

goldMedal21 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 2017-2025

where 'Filed Patents' based on already Granted Patents

21 patents (USPTO):
1. 12431404 - Fatigue failure resistant electronic package (2025-09-30),
2. 11410905 - Optimized weight heat spreader for an electronic package (2022-08-09),
3. 11308257 - Stacked via rivets in chip hotspots (2022-04-19),
4. 11239183 - Mitigating thermal-mechanical strain and warpage of an organic laminate substrate (2022-02-01),
5. 11211262 - Electronic apparatus having inter-chip stiffener (2021-12-28),
6. 11133268 - Crack bifurcation in back-end-of-line (2021-09-28),
7. 10978314 - Multi integrated circuit chip carrier package (2021-04-13),
8. 10957622 - Spatially localized thermal interface materials (2021-03-23),
9. 10903184 - Filler particle position and density manipulation with applications in thermal interface materials (2021-01-26),
10. 10901030 - Viscoelastic pad upon integrated circuit device contact for multipass electrical characterization probe testing (2021-01-26),
11. 10804181 - Heterogeneous thermal interface material for corner and or edge degradation mitigation (2020-10-13),
12. 10553503 - Method and structure for flip-chip package reliability monitoring using capacitive sensors groups (2020-02-04),
13. 10541211 - Control warpage in a semiconductor chip package (2020-01-21),
14. 10541156 - Multi integrated circuit chip carrier package (2020-01-21),
15. 10381276 - Test cell for laminate and method (2019-08-13),

Title: Tuhin Sinha: Innovator in Electronic Package Technologies

Introduction

Tuhin Sinha, based in Oradell, NJ, has emerged as a prominent inventor with a remarkable portfolio of 20 patents. His innovations, particularly in electronic packaging technologies, are paving the way for advancements in thermal management and structural integrity.

Latest Patents

Among his recent patents, one notable invention is the "Optimized Weight Heat Spreader for an Electronic Package." This innovative heat spreader design features regions where material is absent, significantly reducing its weight while maintaining efficient thermal performance for semiconductor chips. Another groundbreaking contribution is the "Stacked Via Rivets in Chip Hotspots." This patent describes a structure that includes dielectric regions with a rivet cell incorporating stacked vias that extend through stress hotspots within the structure, providing critical insights into managing energy release rates across varying dielectric materials.

Career Highlights

Tuhin currently works at International Business Machines Corporation (IBM), a leading technology and consulting company where he applies his extensive knowledge and expertise in the field of electronic packaging. His career is defined by a commitment to pushing the boundaries of technology through thoughtful innovations that enhance product performance and reliability.

Collaborations

Collaborating with notable colleagues such as Jonathan R Fry and Taryn J Davis, Tuhin has been instrumental in driving projects that blend diverse expertise to create cutting-edge solutions. These partnerships not only enhance the innovation process but also contribute to robust research outcomes within IBM.

Conclusion

Tuhin Sinha stands out as a noteworthy inventor whose contributions significantly impact the field of electronic packaging. With his innovative patents and collaborative spirit, he continues to shape the future of technology, focusing on enhancing performance while mitigating weight and stress in electronic devices.

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