The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Jan. 16, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Tuhin Sinha, Oradell, NJ (US);

Steven P. Ostrander, Poughkeepsie, NY (US);

Bhupender Singh, Fishkill, NY (US);

Sylvain Ouimet, St-Hubert, CA;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/16 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); G11C 11/407 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 23/3128 (2013.01); G11C 11/407 (2013.01); H01L 23/04 (2013.01); H01L 23/16 (2013.01); H01L 2924/10253 (2013.01);
Abstract

An electronic apparatus that includes a first semiconductor chip mounted on a substrate; a second semiconductor chip mounted on the substrate; a spacer attached to the substrate and situated between the first and second semiconductor chips; a lid mounted on the substrate and enclosing the first and second semiconductor chips and the spacer, the spacer having an adhesive material adhesively attached to the lid; and underfill material underneath the first and second semiconductor chips, underneath the spacer and between the spacer and the first and second semiconductor chips.


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