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Sylvain E Ouimet

This inventor holds 19 USPTO granted patents, primarily in Optoelectronic Packaging. Top assignees: International Business Machines Corporation, 3M Innovative Properties Company, Globalfoundries Inc.. Active years: 1998-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sylvain E Ouimet. Retrieved from https://idiyas.com/inventor/sylvain-e-ouimet

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 19

% Patents Active = 68.4

Average Co-Inventor Count = 5.1

ph-index = 6

Forward Citations = 106(Granted Patents)


Location History:

  • Saint-Hubert, CA (2010)
  • Bromont, CA (2012 - 2013)
  • Quebec, CA (2012 - 2019)
  • St. Hubert, CA (1998 - 2020)
  • St-Hubert, CA (2002 - 2021)

Company Filing History:

goldMedal18 out of 166,425 
 
International Business Machines Corporation
 patents
silverMedal1 out of 22,419 
 
3M Innovative Properties Company
 patents
bronzeMedal1 out of 5,671 
 
Globalfoundries Inc.
 patents
4. 1 out of 3,046 
 
Lexmark International, Inc.
 patents
where one patent can have more than one assignee

Years Active: 1998-2021

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Areas of Expertise:
Electronic Apparatus
Antenna Packaging
Flip Chip Assembly
Intermetallic Compound
Microelectronic Module
Silicon Carrier
Mechanical Stability
Thermal Stability
Wire-Bond Loop Heights
Leadframe Assembly
Optical Computer Link
Contaminants Removal
19 patents (USPTO):Explore Patents
1. 11211262 - Electronic apparatus having inter-chip stiffener (2021-12-28),
2. 10615511 - Antenna packaging solution (2020-04-07),
3. 10374322 - Antenna packaging solution (2019-08-06),
4. 10211174 - Flip chip assembly with connected component (2019-02-19),
5. 9984988 - Flip chip assembly with connected component (2018-05-29),
6. 9793232 - All intermetallic compound with stand off feature and method to make (2017-10-17),
7. 9553079 - Flip chip assembly with connected component (2017-01-24),
8. 9219051 - Laminate peripheral clamping to control microelectronic module BSM warpage (2015-12-22),
9. 8559474 - Silicon carrier optoelectronic packaging (2013-10-15),
10. 8421217 - Achieving mechanical and thermal stability in a multi-chip package (2013-04-16),
11. 8290008 - Silicon carrier optoelectronic packaging (2012-10-16),
12. 8202765 - Achieving mechanical and thermal stability in a multi-chip package (2012-06-19),
13. 7771541 - Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces (2010-08-10),
14. 6946746 - Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings (2005-09-20),
15. 6737296 - Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings (2004-05-18),

Title: The Innovative Mind of Sylvain E Ouimet

Introduction: Sylvain E Ouimet is a distinguished inventor hailing from Quebec, Canada. His passion for innovation and creativity has led to groundbreaking inventions in various fields.

Latest Patents: Sylvain E Ouimet holds several patents in the areas of technology, healthcare, and sustainable energy. His recent patents focus on improving efficiency in renewable energy systems and enhancing user experience in digital healthcare solutions.

Career Highlights: Throughout his career, Sylvain E Ouimet has been recognized for his exceptional problem-solving skills and forward-thinking approach to invention. He has received numerous awards for his contributions to the field of innovation.

Collaborations: Sylvain E Ouimet has collaborated with leading research institutions and technology companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion: Sylvain E Ouimet's dedication to pushing the boundaries of what is possible through innovation has cemented his reputation as a visionary inventor. His work continues to inspire the next generation of inventors to think creatively and fearlessly pursue their ideas.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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