The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2005

Filed:

Mar. 16, 2004
Applicants:

Frederic Beaulieu, Quebec, CA;

Mark J. Kuzawinski, Maine, NY (US);

Stephane Mainville, Bromont, CA;

Sylvain Ouimet, St-Hubert, CA;

Jean-guy Quintal, Canton de Granby, CA;

Guy Robichaud, Granby, CA;

Inventors:

Frederic Beaulieu, Quebec, CA;

Mark J. Kuzawinski, Maine, NY (US);

Stephane Mainville, Bromont, CA;

Sylvain Ouimet, St-Hubert, CA;

Jean-Guy Quintal, Canton de Granby, CA;

Guy Robichaud, Granby, CA;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/52 ;
U.S. Cl.
CPC ...
Abstract

A method for reducing the number of wire-bond loop heights which are required in comparison with a total quantity of power and signal rings employed in low profile wire-bond integrated circuit packages. There are also provided low profile wire-bond packages which are produced in accordance with the method pursuant to the invention.


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