Company Filing History:
Years Active: 2002-2005
Title: The Innovations of Stephane Mainville
Introduction
Stephane Mainville is a notable inventor based in Bromont, Canada. He has made significant contributions to the field of integrated circuit packaging, holding a total of three patents. His work focuses on improving the efficiency and performance of wire-bond integrated circuits.
Latest Patents
One of his latest patents is a method to reduce the number of wire-bond loop heights versus the total quantity of power and signal rings. This innovative method aims to minimize the required wire-bond loop heights in comparison to the total quantity of power and signal rings used in low-profile wire-bond integrated circuit packages. Additionally, the patent includes low-profile wire-bond packages produced in accordance with this method.
Career Highlights
Stephane Mainville is currently employed at International Business Machines Corporation, commonly known as IBM. His role at IBM allows him to work on cutting-edge technologies and contribute to advancements in the field of electronics.
Collaborations
Throughout his career, Mainville has collaborated with talented individuals such as Frederic Beaulieu and Mark J Kuzawinski. These collaborations have fostered an environment of innovation and creativity, leading to the development of impactful technologies.
Conclusion
Stephane Mainville's contributions to the field of integrated circuit packaging through his patents and work at IBM highlight his role as a significant inventor. His innovative methods continue to influence the industry and pave the way for future advancements.