The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Mar. 14, 2012
Jon A. Casey, Poughkeepsie, NY (US);
John S. Corbin, Jr., Austin, TX (US);
David Danovitch, Quebec, CA;
Isabelle Depatie, Vancouver, CA;
Virendra R. Jadhav, Wappingers Falls, NY (US);
Roger A. Liptak, Hopewell Junction, NY (US);
Kenneth C. Marston, Poughquag, NY (US);
Jennifer V. Muncy, Ridgefield, CT (US);
Sylvain Ouimet, Quebec, CA;
Eric Salvas, Quebec, CA;
Jon A. Casey, Poughkeepsie, NY (US);
John S. Corbin, Jr., Austin, TX (US);
David Danovitch, Quebec, CA;
Isabelle Depatie, Vancouver, CA;
Virendra R. Jadhav, Wappingers Falls, NY (US);
Roger A. Liptak, Hopewell Junction, NY (US);
Kenneth C. Marston, Poughquag, NY (US);
Jennifer V. Muncy, Ridgefield, CT (US);
Sylvain Ouimet, Quebec, CA;
Eric Salvas, Quebec, CA;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.