IDiyas

For the Inventor, By the Inventor

Austin, TX, United States of America

John Saunders Corbin, Jr

USPTO Granted Patents = 42

Average Co-Inventor Count = 4.8

ph-index = 17

Forward Citations = 755(Granted Patents)


Company Filing History:

goldMedal42 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1986-2013

Loading Chart...
42 patents (USPTO):
1. 8421217 - Achieving mechanical and thermal stability in a multi-chip package (2013-04-16),
2. 8202765 - Achieving mechanical and thermal stability in a multi-chip package (2012-06-19),
3. 7777329 - Heatsink apparatus for applying a specified compressive force to an integrated circuit device (2010-08-17),
4. 7701720 - Electronic assembly and techniques for installing a heatsink in an electronic assembly (2010-04-20),
5. 7687894 - IC chip package having automated tolerance compensation (2010-03-30),
6. 7479796 - Functional and stress testing of LGA devices (2009-01-20),
7. 7466155 - Functional and stress testing of LGA devices (2008-12-16),
8. 7463017 - Functional and stress testing of LGA devices (2008-12-09),
9. 7456644 - Functional and stress testing of LGA devices (2008-11-25),
10. 7453279 - Functional and stress testing of LGA devices (2008-11-18),
11. 7425822 - Functional and stress testing of LGA devices (2008-09-16),
12. 7423440 - Functional and stress testing of LGA devices (2008-09-09),
13. 7405583 - Functional and stress testing of LGA devices (2008-07-29),
14. 7352200 - Functional and stress testing of LGA devices (2008-04-01),
15. 7345881 - Non-influencing fastener for mounting a heat sink in contact with an electronic component (2008-03-18),

Title: John Saunders Corbin, Jr: A Visionary Inventor Pioneering Innovation in Austin, TX

Introduction: John Saunders Corbin, Jr, a visionary inventor based in Austin, TX, has made significant contributions to various industries through his dedication to innovation and relentless pursuit of excellence. With 44 patents to his name, he continues to inspire future generations of inventors with his groundbreaking work.

Latest Patents: One of Corbin's latest patents showcases his expertise in achieving mechanical and thermal stability in a multi-chip package. This revolutionary system and method utilize a lid and multiple thermal interface materials to ensure optimal performance and reliability in multi-chip packages.

Career Highlights: Corbin is currently associated with IBM, where he channels his inventive spirit to drive technological advancements. His tenure at IBM has been marked by numerous successful projects that have pushed the boundaries of innovation in the tech industry.

Collaborations: In his professional journey, Corbin has had the privilege of collaborating with esteemed colleagues such as Howard Victor Mahaney, Jr, and Kenneth Carl Larsen. Together, they have worked on pioneering projects that have revolutionized the way we approach technology and engineering.

Conclusion: John Saunders Corbin, Jr's unwavering commitment to innovation and his exceptional talent as an inventor have solidified his reputation as a visionary in the field. His remarkable achievements continue to shape the landscape of technological advancements, leaving a lasting impact on industries and inspiring aspiring inventors worldwide.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…