The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2010
Filed:
Sep. 27, 2006
John S. Corbin, Jr., Austin, TX (US);
David L. Edwards, Poughkeepsie, NY (US);
David C. Long, Wappingers Falls, NY (US);
Jason S. Miller, Poughkeepsie, NY (US);
John S. Corbin, Jr., Austin, TX (US);
David L. Edwards, Poughkeepsie, NY (US);
David C. Long, Wappingers Falls, NY (US);
Jason S. Miller, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.