International Business Machines Corporation

John Saunders Corbin, Jr

Howard Victor Mahaney, Jr

Dales Morrison Kent

Kenneth Carl Larsen

John Lee Colbert

Jose Arturo Garza, Jr

John Joseph Salazar

Hoa Thanh Phan

Arvind Kumar Sinha

Roger Duane Hamilton

Danny E Massey

Budy D Notohardjono

Steven C McIntosh

Johnny Roy Brezina

John Acocella

Karl G Hoebener

Howard P Welz

Joseph Angelo Benenati

Donald R Banks

David P Watson

Thomas Caulfield

Roger R Schmidt

John G Torok

Jon Alfred Casey

David Hirsch Danovitch

Kenneth Charles Marston

William P Kostenko

Virendra R Jadhav

Jason R Eagle

Sylvain E Ouimet

Jennifer V Muncy

Eric Salvas

Ciro Neal Ramirez

Daniel Paul Beaman

James Robert Taylor

Charles C Stratton

Isabelle Depatie

Roger A Liptak

David Clifford Long

Eric Alan Eckberg

David L Edwards

Gary Franklin Goth

John J Loparco

David Lewis Gardell

Stephen Peter Mroz

Howard V Mahaney, Jr

James Dorance Gerken

Christopher Lee Tuma

Darryl Ray Polk

Maurice Francis Holahan

Peter Matthew Thomsen

Mark Wayne Mueller

Jason Scott Miller

Amanda Elisa Mikhail

Terry Leo Sobotta

Frederic William Wright, Iv

Lonnie J Cannon

David Allen Hall

Jeffrey Frank Kutner

Daniel Edward Massey

Jose A Garza

Victor H Mahaney, Jr

A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Achieving mechanical and thermal stability in a multi-chip package

An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.

Heatsink apparatus for applying a specified compressive force to an integrated circuit device

A technique for installing a heatsink in an electronic assembly includes simultaneously applying force to multiple fastener assemblies that each retain a respective fastener in a body of the heatsink. The heatsink is then attached to the electronic assembly by actuating the fasteners while the force is simultaneously applied to the multiple fastener assemblies.

Electronic assembly and techniques for installing a heatsink in an electronic assembly

An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.

IC chip package having automated tolerance compensation

Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Functional and stress testing of LGA devices

A load frame has an open region exposing a surface of an electronic component. A heat sink is disposed on the load frame and has a surface in thermal contact with the surface of the electronic component. A non-influencing fastener is disposed within a bore in the heat sink and threaded into the load frame for securing the heat sink to the load frame. The non-influencing fastener includes a screw with a head; a tapered ring disposed below the head of the screw and having a tapered lower peripheral surface; a sealing ring engaging the tapered lower peripheral surface of the tapered ring; and a load washer disposed between the sealing ring and the load frame. Compression of the rings by turning of the screw into the load frame causes the sealing ring to expand against the bore of the heatsink. Preferably, the sealing ring has a curved outer surface.

Non-influencing fastener for mounting a heat sink in contact with an electronic component

Growing community of inventors

Austin, TX, United States of America

John Saunders Corbin, Jr