Vancouver, Canada

Isabelle Depatie


Average Co-Inventor Count = 10.0

ph-index = 2

Forward Citations = 32(Granted Patents)


Company Filing History:


Years Active: 2012-2013

where 'Filed Patents' based on already Granted Patents

2 patents (USPTO):

Title: The Innovative Contributions of Isabelle Depatie

Introduction

Isabelle Depatie is a prominent inventor based in Vancouver, Canada. She has made significant contributions to the field of technology, particularly in the area of multi-chip packaging. With a total of two patents to her name, her work has garnered attention for its innovative approach to mechanical and thermal stability.

Latest Patents

Isabelle's latest patents focus on achieving mechanical and thermal stability in a multi-chip package. The system and method she developed utilize a lid and multiple thermal interface materials. This innovative approach enhances the performance and reliability of multi-chip packages, which are essential in modern electronic devices.

Career Highlights

Isabelle is currently employed at International Business Machines Corporation, commonly known as IBM. Her role at IBM allows her to work on cutting-edge technologies and contribute to advancements in the industry. Her expertise in multi-chip packaging has positioned her as a valuable asset to her team.

Collaborations

Isabelle has collaborated with notable colleagues, including Jon Alfred Casey and John Saunders Corbin, Jr. These collaborations have further enriched her work and expanded the impact of her inventions.

Conclusion

Isabelle Depatie's contributions to the field of technology through her patents and work at IBM highlight her innovative spirit and dedication to advancing electronic packaging solutions. Her achievements serve as an inspiration for future inventors in the industry.

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