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David Hirsch Danovitch

This inventor holds 34 USPTO granted patents and 2 published patent applications, primarily in Optoelectronic Packaging. Top assignee: International Business Machines Corporation. Active years: 1993-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David Hirsch Danovitch. Retrieved from https://idiyas.com/inventor/david-hirsch-danovitch

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 34 

% Patents Active = 67.6

Average Co-Inventor Count = 4.3

ph-index = 14

Forward Citations = 482(Granted Patents)


Location History:

  • Des Aigles, CA (2000 - 2002)
  • Canton de Granby, CA (2004 - 2012)
  • Quebec, CA (1993 - 2013)
  • Bromont, CA (2012 - 2013)
  • Granby, CA (2000 - 2020)

Company Filing History:

goldMedal34 out of 166,425 
 
International Business Machines Corporation
 patents

Years Active: 1993-2020

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Areas of Expertise:
Gallium Liquid Metal
Integrated Circuit Assembly
Optoelectronic Packaging
Multi-Chip Package
Injection Molded Soldering
Interconnect Structures
Thermal Stability
Solder Bumps
Chip Attachment
Wafer-Level Underfill
Grounding
Electrical Commoning
34 patents (USPTO):Explore Patents
1. 10679966 - Gallium liquid metal embrittlement for device rework (2020-06-09),
2. 10559549 - Gallium liquid metal embrittlement for device rework (2020-02-11),
3. 8689437 - Method for forming integrated circuit assembly (2014-04-08),
4. 8559474 - Silicon carrier optoelectronic packaging (2013-10-15),
5. 8421217 - Achieving mechanical and thermal stability in a multi-chip package (2013-04-16),
6. 8290008 - Silicon carrier optoelectronic packaging (2012-10-16),
7. 8202765 - Achieving mechanical and thermal stability in a multi-chip package (2012-06-19),
8. 8162199 - Mold shave apparatus and injection molded soldering process (2012-04-24),
9. 7952205 - Injection molded soldering process and arrangement for three-dimensional structures (2011-05-31),
10. 7820483 - Injection molded soldering process and arrangement for three-dimensional structures (2010-10-26),
11. 7819376 - Techniques for forming interconnects (2010-10-26),
12. 7786588 - Composite interconnect structure using injection molded solder technique (2010-08-31),
13. 7538432 - Temporary structure to reduce stress and warpage in a flip chip organic package (2009-05-26),
14. 7473618 - Temporary structure to reduce stress and warpage in a flip chip organic package (2009-01-06),
15. 7348270 - Techniques for forming interconnects (2008-03-25),

Title: **David Hirsch Danovitch: Innovator in Gallium Technology**

Introduction

David Hirsch Danovitch is a prominent inventor based in Quebec, Canada, with an impressive portfolio of 34 patents. His work primarily centers around innovations in electrical components and their reworking processes, demonstrating a dedication to enhancing technological efficiency and reliability.

Latest Patents

One of Danovitch's latest patents is titled "Gallium Liquid Metal Embrittlement for Device Rework". This innovative method involves removing an electrical component from a substrate, where the component is connected through various elements. The process includes the application of liquid gallium (Ga) at the edge of the component, facilitating its dispersion between the substrate and the component, thereby enabling the liquid Ga to interact with the connection elements. The technique establishes a period for maintaining the liquid Ga in contact with the substrate and components before the ultimate removal of the component is achieved through mechanical force.

Career Highlights

David Hirsch Danovitch has built his career at the International Business Machines Corporation (IBM), contributing significantly to advancements in technology through his inventive solutions. His prolific output of patents showcases his innovative mindset and commitment to research and development.

Collaborations

Danovitch has collaborated with several notable professionals in the field, including Peter Alfred Gruber and Guy Paul Brouillette. These collaborations highlight the importance of teamwork in driving innovation and the collective effort to push boundaries in technology.

Conclusion

With a strong foundation in electrical technology and a focus on practical rework solutions, David Hirsch Danovitch continues to be a key player in the field of innovation. His contributions not only enhance product life cycles but also pave the way for future advancements in electrical engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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